08054D101BAT2A_技术文档

AVX Surface Mount

Ceramic Capacitor Products

Version 9.4

Ceramic Chip Capacitors

Table of Contents

How to Order - AVX Part Number Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

C0G (NP0) Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7

U Dielectric

RF/Microwave C0G (NP0) Capaciators (RoHS) General Information and Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10

RF/Microwave C0G (NP0) Capaciators (Sn/Pb) General Information and Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-12

Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

X8R Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-15

X7R Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-19

X7S Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

X5R Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Y5V Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

MLCC Tin/Lead Termination (LD Series)

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30-35

MLCC Low Profile

General Specifications / Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

UltraThin Ceramic Capacitors

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Automotive MLCC

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38-39

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40-42

APS for COTS+ Applications

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-45

MLCC with FLEXITERM^®

General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47-48

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49-50

FLEXISAFE MLC Chips

General Specifications and Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Capacitor Array

Capacitor Array (IPC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52-55

Automotive Capacitor Array (IPC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Multi-Value Capacitor Array (IPC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Part and Pad Layout Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Low Inductance Capacitors

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59-60

LICC (Low Inductance Chip Capacitors) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61-64

IDC (InterDigitated Capacitors). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65-68

LGA Low Inductance Capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69-70

LICA (Low Inductance Decoupling Capacitor Arrays) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71-72

High Voltage MLC Chips

600V to 5000V Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73-74

Tin/Lead Termination “B” - 600V to 5000V Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75-76

MIL-PRF-55681/Chips

CDR01 thru CDR06. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77-78

CDR31 thru CDR35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79-82

Packaging of Chip Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Embossed Carrier Configuration - 8 & 12mm Tape. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Paper Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Bulk Case Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Basic Capacitor Formulas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88-92

Surface Mounting Guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93-97

1

How to Order

Part Number Explanation

Commercial Surface Mount Chips

EXAMPLE: 08055A101JAT2A

0805

5

A

101

J*

A

T

2

A

Size

Voltage

Dielectric

A = NP0(C0G)

C = X7R

D = X5R

F = X8R

G = Y5V

U = U Series

W = X6S

Capacitance

2 Sig. Fig +

No. of Zeros

Examples:

Tolerance

Failure

Rate

A = N/A

Terminations

T = Plated Ni

and Sn

7 = Gold Plated

U = Conductive

Expoxy for

Packaging

Available

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

(L" x W") 4 = 4V

B = .10 pF

0201

0402

0603

0805

1206

1210

1812

1825

2220

2225

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

D = 35V

5 = 50V

1 = 100V

2 = 200V

7 = 500V

C = .25 pF

D = .50 pF

F = 1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

J = 5ꢀ

4 = Automotive

100 = 10 pF

101 = 100 pF

102 = 1000 pF

223 = 22000 pF

224 = 220000 pF M = 20ꢀ

105 = 1µF

Hybrid

K = 10ꢀ

Applications

Z = FLEXITERM^®

X = FLEXITERM^®

with 5ꢀ min

lead (X7R &

X8R only)

Contact

Factory For

Multiples

Z = X7S

Z = +80ꢀ, -20ꢀ

P = +100ꢀ, -0ꢀ

106 = 10µF

107 = 100µF

For values below

10 pF, use “R”

in place of

Decimal point, e.g.,

9.1 pF = 9R1.

Contact Factory for

Special Voltages

F = 63V

* = 75V

E = 150V 8 = 400V

V = 250V

Contact

Factory For

1 = Pd/Ag Term

9 = 300V

X = 350V

* B, C & D tolerance for ≤10 pF values.

Standard Tape and Reel material (Paper/Embossed) depends upon chip

size and thickness.

See individual part tables for tape material type for each capacitance value.

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

For Tin/Lead Terminations, please refer to LD Series

High Voltage MLC Chips

EXAMPLE: 1808AA271KA11A

1808

A

271

K

A

T

1

A

AVX

Style

0805

1206

1210

1808

1812

1825

2220

2225

3640

Voltage

Temperature Capacitance Capacitance

Failure

Rate

Packaging/

Marking

1 = 7" Reel

3 = 13" Reel

9 = Bulk

Special

Code

A = Standard

Termination

C = 600V/630V Coefficient

Code

(2 significant digits

+ no. of zeros)

Examples:

10 pF = 100

100 pF = 101

Tolerance

C0G: J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

X7R: K = 10ꢀ

M = 20ꢀ

1= Pd/Ag

A = 1000V

S = 1500V

G = 2000V

W = 2500V

H = 3000V

J = 4000V

K = 5000V

A = C0G

C = X7R

A=Not

T = Plated Ni

and Sn

B = 5ꢀ Min Pb

Z = FLEXITERM^®

X = FLEXITERM^®

with 5ꢀ min

Applicable

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF = 105

Z = +80ꢀ,

-20ꢀ

lead (X7R only)

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

For Tin/Lead Terminations, please refer to LD Series

2

How to Order

Part Number Explanation

Capacitor Array

EXAMPLE: W2A43C103MAT2A

W

2

A

4

3

C

103

M

A

T

2A

Style

W = RoHS

L = SnPb

Case Array Number Voltage Dielectric Capacitance Capacitance

Failure

Rate

Termination

Code

Packaging &

Quantity

Code

Size

of Caps

Code (In pF)

2 Sig Digits +

Number of

Zeros

Tolerance

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

A = NP0

C = X7R

D = X5R

1 = 0405

2 = 0508

3 = 0612

J = 5ꢀ A = Commercial T = Plated Ni and Sn

K = 10ꢀ 4 = Automotive Z = FLEXITERM^®

2A = 7" Reel

(4000)

M = 20ꢀ

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min lead

4A = 13" Reel

(10000)

2F = 7" Reel

(1000)

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Low Inductance Capacitors (LICC)

EXAMPLE: 0612ZD105MAT2A

0612

Z

D

105

M

A

T

2

A

Size

0306

0508

0612

LD16

LD17

LD18

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = 10ꢀ

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

See Page 64

for Codes

A = N/A

T = Plated Ni

and Sn

B = 5ꢀ min

lead

M = 20ꢀ

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Interdigitated Capacitors (IDC)

EXAMPLE: W3L16D225MAT3A

225

M

W

3

L

1

6

D

A

T

3

A

Capacitance Capacitance

Style

W = RoHS

L = SnPb

Case

Size

Low

Number

of

Terminals

1 = 8 Terminals

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

Dielectric

C = X7R

D = X5R

Failure

Rate

A = N/A

Termination Packaging

Thickness

Max. Thickness

mm (in.)

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

Inductance

T = Plated Ni

and Sn

Available

M = 20

2 = 0508 ESL = 50pH

3 = 0612 ESL = 60pH

1=7" Reel

3=13" Reel A=0.95 (0.037)

S=0.55 (0.022)

B = 5ꢀ min

Lead

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Low Inductance Decoupling Capacitor Arrays (LICA)

EXAMPLE: LICA3T183M3FC4AA

4

A

LICA

3

T

102

M

3

F

C

# of

Inspection

Code

Face

Style Voltage Dielectric Cap/Section Capacitance Height

Termination

Reel Packaging

Caps/Part

&

5V = 9 D = X5R

(EIA Code)

Tolerance

Code

F = C4 Solder

M = 7" Reel

1 = one A = Standard

2 = two B = Established B = No Bar

4 = four

A = Bar

Size

10V = Z T = T55T 102 = 1000 pF M = 20ꢀ 6 = 0.500mm

25V = 3 S = High K 103 = 10 nF

T55T 104 = 100 nF

Balls- 97Pb/3Sn R = 13" Reel

P = GMV 3 = 0.650mm H = C4 Solder

6 = 2"x2" Waffle Pack

1 = 0.875mm

Balls–Low ESR 8 = 2"x2" Black Waffle

Reliability

Testing

C = Dot, S55S

Dielectrics

D = Triangle

5 = 1.100mm P = Cr-Cu-Au

7 = 1.600mm N = Cr-Ni-Au

X = None

Pack

7 = 2"x2" Waffle Pack

w/ termination

facing up

A = 2"x2" Black Waffle

Pack

w/ termination

facing up

C = 4"x4" Waffle Pack

w/ clear lid

NOTE: Contact factory for availability of Termination and

Tolerance Options for Specific Part Numbers.

3

C0G (NP0) Dielectric

General Specifications

C0G (NP0) is the most popular formulation of the

“temperature-compensating,” EIA Class I ceramic materials.

Modern C0G (NP0) formulations contain neodymium,

samarium and other rare earth oxides.

C0G (NP0) ceramics offer one of the most stable capacitor

dielectrics available. Capacitance change with temperature

is 0 30ppm/ꢁC which is less than 0.3ꢀ ⌬C from -55ꢁC

to +125ꢁC. Capacitance drift or hysteresis for C0G (NP0)

ceramics is negligible at less than 0.05ꢀ versus up to

2ꢀ for films. Typical capacitance change with life is less

than 0.1ꢀ for C0G (NP0), one-fifth that shown by most

other dielectrics. C0G (NP0) formulations show no aging

characteristics.

PART NUMBER (see page 2 for complete part number explanation)

0805

A

101

J

A

T

2

A

5

Size

(L" x W")

Dielectric

C0G (NP0) = A

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

B = .10 pF (ꢂ10pF)

C = .25 pF (ꢂ10pF)

D = .50 pF (ꢂ10pF)

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

7 = Gold Plated

F

=

1ꢀ (≥ 10 pF)

Contact

Factory For

1 = Pd/Ag Term

G = 2ꢀ (≥ 10 pF)

5ꢀ

K = 10ꢀ

Contact

Factory

For

J

=

Multiples

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

Temperature Coefficient

Insulation Resistance vs Temperature

⌬ Capacitance vs. Frequency

10,000

1,000

100

+2

Typical Capacitance Change

Envelope: 0 30 ppm/°C

+1

+0.5

0

-1

-2

-0.5

0

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

-55 -35

+125

-15 +5 +25 +45 +65 +85 +105

40

60

80

100

0

20

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

0805 - C0G (NP0)

Variation of Impedance with Ceramic Formulation

Impedance vs. Frequency

1000 pF - C0G (NP0) vs X7R

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

1000 pF - C0G (NP0)

10 pF vs. 100 pF vs. 1000 pF

100,000

10

10.00

1206

0805

1812

1210

X7R

NPO

10,000

1,000

100

1.00

1.0

0.1

0.10

0.01

10 pF

10.0

1.0

0.1

100

1000

10

100 pF

1000 pF

100

1000

10

Frequency, MHz

1

100

Frequency, MHz

1000

10

4

C0G (NP0) Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF

1.0 kHz 10ꢀ for cap ꢃ 1000 pF

Voltage: 1.0Vrms .2V

Charge device with rated voltage for

60 5 secs ꢄ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

-55ºC to +125ºC

Within specified tolerance

ꢂ30 pF: Q≥ 400+20 x Cap Value

≥30 pF: Q≥ 1000

100,000MΩ or 1000MΩ - µF,

whichever is less

Q

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

No defects

Deflection: 2mm

Test Time: 30 seconds

5ꢀ or .5 pF, whichever is greater

Resistance to

Flexure

1mm/sec

Q

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, ꢂ25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤ 2.5ꢀ or .25 pF, whichever is greater

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

2

Resistance to

Solder Heat

Q

Meets Initial Values (As Above)

Insulation

Resistance

Dielectric

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 2.5ꢀ or .25 pF, whichever is greater

≤ 3 minutes

Thermal

Shock

Q

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

Insulation

Resistance

Dielectric

≤ 3 minutes

Repeat for 5 cycles and measure after

24 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤ 3.0ꢀ or .3 pF, whichever is greater

Charge device with twice rated voltage in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0).

≥ 30 pF:

≥10 pF, ꢂ30 pF:

ꢂ10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Q

Load Life

(C=Nominal Cap)

Insulation

Resistance

Dielectric

Remove from test chamber and stabilize at

room temperature for 24 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤ 5.0ꢀ or .5 pF, whichever is greater

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≥ 30 pF:

≥10 pF, ꢂ30 pF:

ꢂ10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Load

Q

Humidity

Insulation

Resistance

Dielectric

Strength

Remove from chamber and stabilize at

room temperature for 24 2 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

5

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

1206

Soldering

Packaging

Reflow Only

All Paper

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

0.60 0.03

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.024 0.001)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.30 0.03

(0.011 0.001)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

25

A

50

16

C

25

C

50

C

16

G

25

G

50

G

100

G

16

J

25

J

50

J

N

100

J

200

J

16

J

M

25

J

M

50

J

M

100

J

M

P

200

J

500

J

Cap

(pF)

A

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

J

M

P

M

J

M

Q

W

L

᭢

Cap

(µF)

T

᭢

t

WVDC

25

50

16

25

50

16

25

50

100

16

25

50

100

200

16

25

50

100

200

500

SIZE

0201

0402

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

1.52

(0.060)

PAPER

EMBOSSED

6

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1812

1825

2220

2225

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.70 0.40

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.016)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

5.00 0.40

(0.197 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

0.5

1.0

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

50

100

200

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

W

L

᭢

T

᭢

3.9

4.7

5.6

6.8

8.2

t

10

12

J

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

M

J

K

M

K

P

X

M

P

Q

X

M

P

M

P

M

Y

P

Y

M

Q

J

M

X

Y

X

K

M

Cap

(µF)

K

M

P

Y

P

0.068

0.082

0.1

M

P

Q

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

50

100

200

SIZE

1210

1812

1825

2220

2225

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

7

RF/Microwave C0G (NP0)

Capacitors (RoHS)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

“U” Series capacitors are C0G (NP0) chip capacitors spe-

cially designed for “Ultra” low ESR for applications in the

communications market. Max ESR and effective capacitance

are met on each value producing lot to lot uniformity.

Sizes available are EIA chip sizes 0603, 0805, and 1210.

DIMENSIONS: inches (millimeters)

0402

0603

0805

1210

A

E

A

E

C

B

C

B

C

D

E

inches (mm)

Size

0402

0603

0805

1210

A

B

C

D

N/A

E

N/A

0.039 0.004 (1.00 0.1)

0.060 0.010 (1.52 0.25) 0.030 0.010 (0.76 0.25)

0.079 0.008 (2.01 0.2)

0.126 0.008 (3.2 0.2)

0.020 0.004 (0.50 0.1)

0.024 (0.6) max

0.036 (0.91) max

0.010 0.005 (0.25 0.13)

0.030 (0.76) min

0.020 (0.51) min

0.049 0.008 (1.25 0.2)

0.098 0.008 (2.49 0.2)

0.040 0.005 (1.02 0.127) 0.020 0.010 (0.51 0.255)

0.050 0.005 (1.27 0.127) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min

HOW TO ORDER

0805

1

U

100

J

A

T

2

A

Case Size

0402

Dielectric =

Ultra Low

ESR

Capacitance

Tolerance

Code

Termination

T= Plated Ni

and Sn

Special

Code

A = Standard

0603

0805

1210

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1ꢀ

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Voltage

Code

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Failure Rate

Code

A = Not Appli-

cable

Packaging

Code

2 = 7" Reel

4 = 13" Reel

9 = Bulk

Capacitance

EIA Capacitance Code in pF.

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or after

“R” significant figures.

NOTE: Contact factory for availability of Termination and Toler-

ance Options for Specific Part Numbers.

ELECTRICAL CHARACTERISTICS

Dielectric Working Voltage (DWV):

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 22 pF ꢄ 1 MHz

Size 0603 - 1.0 pF to 100 pF ꢄ 1 MHz

Size 0805 - 1.6 pF to 160 pF ꢄ 1 MHz

Size 1210 - 2.4 pF to 1000 pF ꢄ 1 MHz

250ꢀ of rated WVDC

Equivalent Series Resistance Typical (ESR):

0402 - See Performance Curve, page 9

0603 - See Performance Curve, page 9

0805 - See Performance Curve, page 9

1210 - See Performance Curve, page 9

Temperature Coefficient of Capacitance (TC):

0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)

Marking: Laser marking EIA J marking standard

(except 0603) (capacitance code and

tolerance upon request).

Insulation Resistance (IR):

10¹²Ω min. ꢄ 25ꢁC and rated WVDC

10¹¹Ω min. ꢄ 125ꢁC and rated WVDC

Working Voltage (WVDC):

MILITARY SPECIFICATIONS

Size

Working Voltage

Meets or exceeds the requirements of MIL-C-55681

0402 - 50, 25 WVDC

RoHS COMPLIANT

0603 - 200, 100, 50 WVDC

0805 - 200, 100 WVDC

1210 - 200, 100 WVDC

Pb: Free

8

RF/Microwave C0G (NP0)

Capacitors (RoHS)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Available

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Available

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 50V 200V 200V 200V

100

110

F,G,J,K,M N/A 100V 200V 200V

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

50V N/A N/A N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

50V 200V 200V 200V

᭡

50V

᭡

B,C,J,K,M

F,G,J,K,M

120

50V

130

N/A 200V

B,C

B,C,D

140

100V

᭡

150

᭡

160

100V

N/A

᭡

180

B,C,D

200V

100V

200

220

270

300

᭡

330

50V

N/A

360

᭡

390

430

200V

100V

470

510

560

620

680

750

᭡

820

᭡

910

B,C,D

B,C,J,K,M

᭡

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

TYPICAL ESR vs. FREQUENCY

0402 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0603 “U” SERIES

1

10 pF

15 pF

3.3 pF

3.9 pF

4.7 pF

5.1 pF

6.8 pF

10.0 pF

15.0 pF

0.1

0.01

2500

0

500

1000

Frequency (MHz)

2000

500

1000

Frequency (MHz)

2000

1500

TYPICAL ESR vs. FREQUENCY

1210 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0805 “U” SERIES

1

100 pF

10.0 pF

10 pF

100 pF

0.1

300 pF

0.01

2500

0

500

1000

2000

500

1000

Frequency (MHz)

2000

1500

Frequency (MHz)

ESR Measured on the Boonton 34A

RoHS COMPLIANT

Pb: Free

9

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

F r e q u e n c y ( G H z )

10

RF/Microwave C0G (NP0)

Capacitors (Sn/Pb)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

“U” Series capacitors are C0G (NP0) chip capacitors specially

designed for “Ultra” low ESR for applications in the commu-

nications market. Max ESR and effective capacitance

are met on each value producing lot to lot uniformity.

Sizes available are EIA chip sizes 0603, 0805, and 1210.

DIMENSIONS: inches (millimeters)

0402

0603

0805

1210

A

E

A

E

C

B

C

B

C

D

E

inches (mm)

Size

0402

0603

0805

1210

A

B

C

D

N/A

E

N/A

0.039 0.004 (1.00 0.1)

0.060 0.010 (1.52 0.25) 0.030 0.010 (0.76 0.25)

0.079 0.008 (2.01 0.2)

0.126 0.008 (3.2 0.2)

0.020 0.004 (0.50 0.1)

0.024 (0.6) max

0.036 (0.91) max

0.010 0.005 (0.25 0.13)

0.030 (0.76) min

0.020 (0.51) min

0.049 0.008 (1.25 0.2)

0.098 0.008 (2.49 0.2)

0.040 0.005 (1.02 0.127) 0.020 0.010 (0.51 0.254)

0.050 0.005 (1.27 0.127) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min

HOW TO ORDER

LD05

1

U

100

J

A

B

2

A

Case Size

LD02 = 0402

LD03 = 0603

LD05 = 0805

LD10 = 1210

Dielectric =

Capacitance

Tolerance

Code

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1ꢀ

Termination

B = 5ꢀ min lead

Special Code

A = Standard

Ultra Low ESR

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Voltage Code

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Failure Rate

Code

A = Not Applica-

ble

Packaging

Code

2 = 7" Reel

4 = 13" Reel

9 = Bulk

Capacitance

EIA Capacitance Code in pF.

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or after

“R” significant figures.

ELECTRICAL CHARACTERISTICS

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 22 pF ꢄ 1 MHz

Size 0603 - 1.0 pF to 100 pF ꢄ 1 MHz

Size 0805 - 1.6 pF to 160 pF ꢄ 1 MHz

Size 1210 - 2.4 pF to 1000 pF ꢄ 1 MHz

Dielectric Working Voltage (DWV):

250ꢀ of rated WVDC

Equivalent Series Resistance Typical (ESR):

Temperature Coefficient of Capacitance (TC):

0402

0603

0805

1210

-

See Performance Curve, page 12

0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)

Insulation Resistance (IR):

10¹²Ω min. ꢄ 25ꢁC and rated WVDC

10¹¹Ω min. ꢄ 125ꢁC and rated WVDC

Marking: Laser marking EIA J marking standard

(except 0603) (capacitance code and

tolerance upon request).

Working Voltage (WVDC):

Size

Working Voltage

50, 25 WVDC

200, 100, 50 WVDC

200, 100 WVDC

0402

0603

0805

1210

-

MILITARY SPECIFICATIONS

Meets or exceeds the requirements of MIL-C-55681

11

RF/Microwave C0G (NP0)

Capacitors (Sn/Pb)

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Size

Cap (pF) Tolerance LD02 LD03 LD05 LD10

Size

Cap (pF) Tolerance LD02 LD03 LD05 LD10

Size

Cap (pF) Tolerance LD02 LD03 LD05 LD10

Available

Cap (pF) Tolerance LD02 LD03 LD05 LD10

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 50V 200V 200V 200V

100

110

120

130

140

150

160

180

200

220

270

300

330

360

390

430

470

510

560

620

680

750

820

910

F,G,J,K,M N/A 100V 200V 200V

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

50V N/A N/A N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

50V 200V 200V 200V

᭡

50V

᭡

B,C,J,K,M

F,G,J,K,M

50V

N/A 200V

B,C

B,C,D

100V

᭡

100V

N/A

᭡

B,C,D

200V

100V

᭡

50V

N/A

᭡

200V

100V

᭡

B,C,D

B,C,J,K,M

᭡

᭡ ᭡

᭡

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

TYPICAL ESR vs. FREQUENCY

0402 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0603 “U” SERIES

1

10 pF

15 pF

3.3 pF

3.9 pF

4.7 pF

5.1 pF

6.8 pF

10.0 pF

15.0 pF

0.1

0.01

2500

0

500

1000

Frequency (MHz)

2000

500

1000

Frequency (MHz)

2000

1500

TYPICAL ESR vs. FREQUENCY

1210 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0805 “U” SERIES

1

100 pF

10.0 pF

10 pF

100 pF

0.1

300 pF

0.01

2500

0

500

1000

2000

500

1000

Frequency (MHz)

2000

1500

Frequency (MHz)

ESR Measured on the Boonton 34A

12

Designer Kits

Communication Kits “U” Series

“U” SERIES KITS

0402

Kit 5000 UZ

Cap.

0603

Kit 4000 UZ

Cap.

Value Tolerance Value Tolerance

pF

1.0

1.2

1.5

1.8

2.0

2.4

2.7

3.0

3.3

3.9

4.7

5.6

6.8

7.5

8.2

0.5

1.0

1.5

1.8

2.2

2.4

3.0

3.6

4.7

5.6

6.8

B ( 0.1pF)

J ( 5ꢀ)

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

8.2

B ( 0.1pF)

10.0

12.0

15.0

B ( 0.1pF)

J ( 5ꢀ)

***25 each of 15 values

***25 each of 24 values

0805

Kit 3000 UZ

1210

Kit 3500 UZ

Cap.

Value Tolerance Value Tolerance

pF

1.0

1.5

2.2

2.4

2.7

3.0

3.3

3.9

4.7

5.6

7.5

8.2

9.1

10.0

12.0

15.0

18.0

22.0

24.0

27.0

33.0

2.2

2.7

4.7

5.1

6.8

8.2

9.1

10.0

13.0

15.0

18.0

20.0

24.0

27.0

30.0

36.0

39.0

47.0

B ( 0.1pF) 51.0

56.0

68.0

82.0

100.0

120.0

B ( 0.1pF) 36.0

39.0

47.0

56.0

68.0

82.0

J ( 5ꢀ)

130.0

240.0

J ( 5ꢀ)

300.0

100.0

130.0

390.0

470.0

680.0

J ( 5ꢀ)

160.0

***25 each of 30 values

13

X8R Dielectric

General Specifications

AVX have developed a range of multilayer ceramic capacitors designed for use in applications up to

150ºC. These capacitors are manufactured with an X8R dielectric material which has a capacitance

variation of 15ꢀ between -55ºC and +150ºC.

The need for X8R performance has been driven by customer requirements for parts that operate at

elevated temperatures. They provide a highly reliable capacitor with low loss and stable capacitance

over temperature.

They are ideal for automotive under the hood sensors, measure while drilling and log while drilling.

Typical applications include wire line logging tools such as gamma ray receivers, acoustic

transceivers and micro-resistivity tools. They can also be used as bulk capacitors for high

temperature camera modules.

X8R capacitors are available as standard and Automotive AEC-Q200 qualified parts. Optional

termination systems, tin, FLEXITERM^®and conductive epoxy for hybrid applications are available.

Providing this series with our FLEXITERM^®termination system provides further advantage to

customers by way of enhanced resistance to both, temperature cycling and mechanical damage.

PART NUMBER (see page 2 for complete part number explanation)

0805

5

F

104

K

4

T

2

A

Size

0603

0805

1206

Voltage

25V = 3

50V = 5

Dielectric

X8R = F

Capacitance Capacitance

Failure

Rate

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code (In pF)

2 Sig. Digits +

Number of

Tolerance

J = 5ꢀ

4 = Automotive

A = Not

K = 10ꢀ

M = 20ꢀ

Z = FLEXITERM^®

U = Conductive

Epoxy for

Applicable

Zeros

e.g. 10µF = 106

Hybrid apps

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

SIZE

0603

0805

1206

WVDC

270

330

470

680

25V

G

50V

G

25V

50V

25V

50V

271

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

Cap

(pF)

J

N

J

N

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

Cap

(µF)

J

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

PAPER

EMBOSSED

= AEC-Q200 Qualified

14

X8R Dielectric

General Specifications

APPLICATIONS FOR X8R CAPACITORS

• All market sectors with a 150ꢁC requirement

• Automotive on engine applications

• Oil exploration applications

• Hybrid automotive applications

– Battery control

– Inverter / converter circuits

– Motor control applications

– Water pump

• Hybrid commercial applications

– Emergency circuits

– Sensors

– Temperature regulation

ADVANTAGES OF X8R MLC CAPACITORS

• Capacitance variation of 15ꢀ between –55ꢁC and

+150ꢁC

• Qualified to the highest automotive AEC-Q200 standards

• Excellent reliability compared to other capacitor

technologies

• RoHS compliant

• Low ESR / ESL compared to other technologies

• Tin solder finish

• FLEXITERM^®available

• Hybrid available

• 50V range available

ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS

• Samples

• Technical Articles

• Application Engineering

• Application Support

X8R Dielectric

0805, 50V, X8R Typical Temperature Coefficient

5.00

0.00

-5.00

-10.00

-15.00

X7R included

for comparison

-20.00

-25.00

-60

-40

-20

0

20

40

60

80

100

120

140

160

Temperature (°C)

15

X7R Dielectric

General Specifications

X7R formulations are called “temperature stable” ceramics

and fall into EIA Class II materials. X7R is the most popular of

these intermediate dielectric constant materials. Its tempera-

ture variation of capacitance is within

15ꢀ from

-55ꢁC to +125ꢁC. This capacitance change is non-linear.

Capacitance for X7R varies under the influence of electrical

operating conditions such as voltage and frequency.

X7R dielectric chip usage covers the broad spectrum of

industrial applications where known changes in capacitance

due to applied voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

0805

5

C

103

M

A

T

2

A

Size

(L" x W")

Voltage

4V = 4

Dielectric

X7R = C

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

J = 5ꢀ*

Failure

Rate

A = Not

Applicable

Terminations

Packaging

2 = 7" Reel

Special

Code

A = Std. Product

T = Plated Ni

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

and Sn

K = 10ꢀ

7 = Gold Plated*

M = 20ꢀ

Z= FLEXITERM^®**

*≤1µF only

Contact

Factory For

Multiples

*Optional termination

**See FLEXITERM^®

X7R section

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

X7R Dielectric

Insulation Resistance vs Temperature

⌬ Capacitance vs. Frequency

Typical Temperature Coefficient

10,000

1,000

100

+30

10

+20

+10

5

0

-5

0

-10

-20

-30

-10

-15

-20

-25

0

20

40

60

80

100

120

-60 -40

100 140

120

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

-20

0

20 40 60 80

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7R

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7R

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7R

10

10.00

10

1206

0805

1210

1206

0805

1210

1,000 pF

10,000 pF

1.0

0.1

.01

1.00

1.0

0.10

0.01

0.1

.01

100

1,000

1

10

100

1000

10

100

1,000

1

10

Frequency, MHz

16

X7R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7R Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +125ºC

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.0ꢀ for 25V DC rating

≤ 3.5ꢀ for 16V DC rating

≤ 5.0ꢀ for ≤ 10V DC rating

100,000MΩ or 1000MΩ - µF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap ꢃ 10 µF, 0.5Vrms ꢄ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs ꢄ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150ꢀ of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ 12ꢀ

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95ꢀ of each terminal should be covered

with fresh solder

No defects, ꢂ25ꢀ leaching of either end terminal

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

≤ 7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

≤ 7.5ꢀ

Appearance

Capacitance

Variation

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0)

≤ 12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ 12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

17

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

1206

Soldering

Packaging

Reflow Only

All Paper

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

0.60 0.03

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.024 0.001)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.30 0.03

(0.011 0.001)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

100

150

220

330

10

16

A

25

16

25

50

6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 500

Cap

(pF)

A

C

G

J

N

J

N

J

N

J

N

K

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

J

P

Q

J

M

P

C

Cap

(µF

J

P

G

J

M

P

N

G

J

C

G

M

Q

G

J*

N

J

M

Q

M

P

Q

M

Q

J*

1.5

2.2

J*

P*

3.3

4.7

10

P*

Q*

P*

22

Q*

47

100

WVDC

10

16

25

16

25 50

6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 6.3

10

16

25

50

100 200 500

SIZE

0201

0402

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

1.52

(0.060)

2.54

(0.100)

2.79

(0.110)

PAPER

EMBOSSED

*Optional Specifications – Contact factory

18

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1812

1825

2220

2225

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.70 0.40

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.016)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

5.00 0.40

(0.197 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

25

50

100

200

50

100

Cap

(pF)

100

150

220

W

L

᭢

330

470

T

᭢

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

t

J

M

N

X

Z

Z*

J

M

N

X

Z

Z*

J

M

P

Z

Z*

J

M

X

Z

J

M

P

Cap

(µF

K

M

Z

K

M

P

Q

X

K

P

X

K

P

X

Z

M

P

X

Z

X

Z

X

M

P

X

Q

J

M

Z

M

P

Q

X

Z

P

1.5

2.2

3.3

4.7

10

22

Z

47

100

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

25

50

100

200

50

100

SIZE

1210

1812

1825

2220

2225

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

2.54

(0.100)

PAPER

EMBOSSED

*Optional Specifications – Contact factory

19

X7S Dielectric

General Specifications

GENERAL DESCRIPTION

X7S formulations are called “temperature stable” ceramics and fall

into EIA Class II materials. Its temperature variation of capacitance

is within 22ꢀ from –55ꢁC to +125ꢁC. This capacitance change is

non-linear.

Capacitance for X7S varies under the influence of electrical operating

conditions such as voltage and frequency.

X7S dielectric chip usage covers the broad spectrum of industrial

applications where known changes in capacitance due to applied

voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

1206

Z

105

M

A

T

2

A

Size

(L" x W")

Voltage

4 = 4V

Dielectric

Z = X7S

Capacitance Capacitance

Failure

Rate

A = N/A

Special

Code

A = Std.

Product

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = 10ꢀ

M = 20ꢀ

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

4 = 13" Reel

7 = Bulk Cass.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

TYPICAL ELECTRICAL CHARACTERISTICS

X7S Dielectric

Typical Temperature Coefficient

Insulation Resistance vs Temperature

⌬ Capacitance vs. Frequency

10,000

1,000

100

10

5

+30

+20

+10

0

-5

0

-10

-20

-30

-10

-15

-20

-25

-60 -40 -20

0

20 40 60 80 100 120 140

0

20

40

60

80

100

120

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

Temperature (°C)

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7S

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7S

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7S

10

10.00

10

1206

0805

1210

1206

0805

1210

1,000 pF

10,000 pF

1.0

0.1

.01

1.00

1.0

0.10

0.01

0.1

.01

100

1,000

1

10

100

1000

10

100

1,000

1

10

Frequency, MHz

20

X7S Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7S Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +125ºC

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.0ꢀ for 25V DC rating

≤ 3.5ꢀ for 16V DC rating

≤ 5.0ꢀ for ≤ 10V DC rating

100,000MΩ or 1000MΩ - µF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap ꢃ 10 µF, 0.5Vrms ꢄ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs ꢄ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ 12ꢀ

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95ꢀ of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, ꢂ25ꢀ leaching of either end terminal

≤ 7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

hours before measuring electrical properties.

Meets Initial Values (As Above)

No visual defects

≤ 7.5ꢀ

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 125ºC 2ºC

for 1000 hours (+48, -0)

≤ 12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ 12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

21

X7S Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Reflow Only

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

6.3

25

4

6.3

10

6.3

Cap

(pF)

100

150

220

330

W

L

᭢

470

680

T

᭢

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

t

Cap

(µF

C

G

1.5

2.2

3.3

4.7

N

Q

10

22

Z

47

100

WVDC

6.3

25

4

6.3

10

6.3

SIZE

0402

0603

0805

1206

1210

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

22

X5R Dielectric

General Specifications

GENERAL DESCRIPTION

• General Purpose Dielectric for Ceramic Capacitors

• EIA Class II Dielectric

• Temperature variation of capacitance is within 15ꢀ

from -55ꢁC to +85ꢁC

• Well suited for decoupling and filtering applications

• Available in High Capacitance values (up to 100µF)

PART NUMBER (see page 2 for complete part number explanation)

1210

4

D

107

M

A

T

2

A

Size

(L" x W")

Voltage

4 = 4V

Dielectric

D = X5R

Capacitance Capacitance

Failure

Rate

A = N/A

Special

Code

A = Std.

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = 10ꢀ

M = 20ꢀ

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

D = 35V

5 = 50V

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

TYPICAL ELECTRICAL CHARACTERISTICS

Temperature Coefficient

Insulation Resistance vs Temperature

10,000

1,000

100

20

15

10

5

0

-5

-10

-15

-20

0

-60 -40

-20

0

+20 +40 +60 +80

0

20

40

60

80

100

120

Temperature °C

23

X5R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X5R Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +85ºC

Within specified tolerance

≤ 2.5ꢀ for ≥ 50V DC rating

≤ 3.0ꢀ for 25V DC rating

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap ꢃ 10 µF, 0.5Vrms ꢄ 120Hz

Dissipation Factor

≤ 12.5ꢀ Max. for 16V DC rating and lower

Contact Factory for DF by PN

10,000MΩ or 500MΩ - µF,

whichever is less

Charge device with rated voltage for

120 5 secs ꢄ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ 12ꢀ

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95ꢀ of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, ꢂ25ꢀ leaching of either end terminal

≤ 7.5ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

hours before measuring electrical properties.

Meets Initial Values (As Above)

No visual defects

≤ 7.5ꢀ

Step 1: -55ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Charge device with 1.5X rated voltage in

test chamber set at 85ºC 2ºC for 1000 hours

(+48, -0). Note: Contact factory for *optional

specification part numbers that are tested at

ꢂ 1.5X rated voltage.

Meets Initial Values (As Above)

No visual defects

≤ 12.5ꢀ

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ 12.5ꢀ

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

24

X5R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

1206

1210

1812

Soldering

Packaging

Reflow Only

All Paper

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Reflow Only

Paper/Embossed

All Embossed

mm

(in.)

0.60 0.03

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

4.50 0.30

(L) Length

(0.024 0.001)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

(0.177 0.012)

mm

(in.)

0.30 0.03

(0.011 0.001)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

(t) Terminal

WVDC

4

6.3 10 16 25

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

4

6.3 10 16 25 35 50 6.3 10 25 50

Cap

(pF)

100

150

220

A

C

330

470

680

A

C

W

L

᭢

T

᭢

1000

1500

2200

A

C

A

t

3300

4700

6800

A

C

G

Cap

(µF)

0.010

0.015

0.022

A

C

G

A

*

C

N

0.033

0.047

0.068

C

G

N

A

0.10

0.15

0.22

A

*

C

G

N

A*

A

C

*

G

Q

0.33

0.47

0.68

G

N

C*

C

Q

X

1.0

1.5

2.2

C

*

C

*

C*

G

J*

N

P*

Q

X

Z

X

C

G

*

G*

J*

*

N

Q

3.3

4.7

10

J*

J

*

J

*

J

N

Q

E*

J*

N*

*

Q

Z

K

N*

Q*

X

Z

Z*

Z

22

47

N*

*

Q*

Z

Z*

Q*

Z*

100

WVDC

Z

4

*

Z*

6.3 10 16 25 35 50 6.3 10 25 50

4

6.3 10 16 25

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

SIZE

0201

0402

0603

0805

1206

1210

1812

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.94

(0.037)

PAPER

EMBOSSED

= Under Development

= *Optional Specifications – Contact factory

NOTE: Contact factory for non-specified capacitance values

25

Y5V Dielectric

General Specifications

Y5V formulations are for general-purpose use in a limited

temperature range. They have a wide temperature

characteristic of +22ꢀ –82ꢀ capacitance change over the

operating temperature range of –30ꢁC to +85ꢁC.

These characteristics make Y5V ideal for decoupling

applications within limited temperature range.

PART NUMBER (see page 2 for complete part number explanation)

0805

3

G

104

Z

A

T

2

A

Size

(L" x W")

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

Dielectric

Y5V = G

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

Z = +80 –20ꢀ

Capacitance Change

vs. DC Bias Voltage

Temperature Coefficient

Insulation Resistance vs. Temperature

10,000

+20

+10

0

+40

+20

0

-10

1,000

100

0

-20

-30

-40

-50

-60

-70

-80

-20

-40

-60

-80

-100

-55 -35

+125

+20

+30

+40 +50 +60

+70 +80 +90

-15 +5 +25 +45 +65 +85 +105

0

20

40

60

100

80

Temperature °C

% DC Bias Voltage

0.1 ␮F - 0603

Impedance vs. Frequency

0.22 ␮F - 0805

Impedance vs. Frequency

1 ␮F - 1206

Impedance vs. Frequency

1,000

100

10

1,000

10,000

1,000

100

10

1

100

10

1

0.1

0.01

10,000

0.01

10,000

0.01

10,000

100,000

1,000,000

10,000,000

1,000,000

10,000,000

1,000,000

10,000,000

Frequency (Hz)

26

Y5V Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

Y5V Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-30ºC to +85ºC

Within specified tolerance

≤ 5.0ꢀ for ≥ 50V DC rating

≤ 7.0ꢀ for 25V DC rating

≤ 9.0ꢀ for 16V DC rating

≤ 12.5ꢀ for ≤ 10V DC rating

10,000MΩ or 500MΩ - µF,

whichever is less

Freq.: 1.0 kHz 10ꢀ

Voltage: 1.0Vrms .2V

For Cap ꢃ 10 µF, 0.5Vrms ꢄ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 5 secs ꢄ room temp/humidity

Charge device with 300ꢀ of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ 30ꢀ

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.1

90 mm

≥ 95ꢀ of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 5ºC

for 5.0 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, ꢂ25ꢀ leaching of either end terminal

≤ 20ꢀ

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24

2

Resistance to

Solder Heat

Meets Initial Values (As Above)

hours before measuring electrical properties.

Meets Initial Values (As Above)

No visual defects

≤ 20ꢀ

Step 1: -30ºC 2º

Step 2: Room Temp

30 3 minutes

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC 2º

Step 4: Room Temp

30 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with twice rated voltage in

test chamber set at 85ºC 2ºC

for 1000 hours (+48, -0)

≤ 30ꢀ

≤ Initial Value x 1.5 (See Above)

≥ Initial Value x 0.1 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC 2ºC/

85ꢀ 5ꢀ relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ 30ꢀ

Load

Humidity

≤ Initial Value x 1.5 (See above)

≥ Initial Value x 0.1 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 2 hours before measuring.

27

Y5V Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

0201

Reflow Only

All Paper

0402

Reflow/Wave

All Paper

0603

Reflow/Wave

All Paper

0805

1206

1210

Reflow/Wave

Reflow Only

Paper/Embossed

mm

(in.)

0.60 0.03

(0.024 0.001)

1.00 0.10

(0.040 0.004)

1.60 0.15

(0.063 0.006)

2.01 0.20

(0.079 0.008)

3.20 0.20

(0.126 0.008)

3.20 0.20

(0.126 0.008)

(L) Length

mm

(in.)

0.30 0.03

(0.011 0.001)

0.50 0.10

(0.020 0.004)

.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

6.3

10

6

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

Cap

(pF)

820

1000

2200

A

W

L

᭢

4700

0.010

0.022

A

T

Cap

(µF)

A

᭢

0.047

0.10

0.22

A

C

t

C

G

K

N

G

0.33

0.47

1.0

G

C

6

C

G

N

M

N

2.2

4.7

10.0

N

P

Q

N

Q

N

Q

X

22.0

47.0

WVDC

6.3

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

SIZE

0201

0402

0603

0805

1206

1210

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

28

MLCC Tin/Lead Termination “B”

General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5ꢀ minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

PART NUMBER (see page 2 for complete part number explanation)

LD05

A

101

J

A

B

2

A

5

Size

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

Dielectric

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

B = 5ꢀ min lead

X = FLEXITERM^®

with 5ꢀ min

Packaging

2 = 7" Reel

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

C0G (NP0) = A Code (In pF)

X7R = C

X5R = D

X8R = F

B = .10 pF (ꢂ10pF)

C = .25 pF (ꢂ10pF)

D = .50 pF (ꢂ10pF)

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

2 Sig. Digits +

Number of

Zeros

lead**

F

=

1ꢀ (≥ 10 pF)

G = 2ꢀ (≥ 10 pF)

Contact

Factory

For

**X7R only

J

=

5ꢀ

K = 10ꢀ

M = 20ꢀ

Multiples

*LD04 has the same CV ranges as LD03.

See FLEXITERM^®section

for CV options

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

NP0

X7R

X7S

X5R

Y5V

Refer to page 4 for Electrical Graphs

Refer to page 16 for Electrical Graphs

Refer to page 20 for Electrical Graphs

Refer to page 23 for Electrical Graphs

Refer to page 26 for Electrical Graphs

29

MLCC Tin/Lead Termination “B”

Capacitance Range (NP0 Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

16

C

25

C

50

C

16

G

25

G

50

G

100

G

16

J

25

50

J

N

100

200

J

16

J

M

25

J

M

50

J

M

100

J

M

P

200

J

500

J

Cap

(pF)

J

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

J

M

P

M

J

M

Q

Cap

(µF)

W

L

᭢

T

᭢

t

WVDC

16

25

50

16

25

50

100

16

25

50

100

200

16

25

50

100

200

500

SIZE

LD02

LD03

LD05

LD06

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

30

MLCC Tin/Lead Termination “B”

Capacitance Range (NP0 Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD10

LD12

LD13

LD14

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

0.5

1.0

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

W

L

᭢

T

᭢

3.9

4.7

5.6

6.8

8.2

t

10

12

J

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

M

J

K

M

K

P

X

M

P

Q

X

M

P

M

P

M

Y

P

Y

M

Q

J

M

K

M

Cap

(µF)

K

M

P

Y

P

0.068

0.082

0.1

M

P

Q

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

50

100

200

SIZE

LD10

LD12

LD13

LD14

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

31

MLCC Tin/Lead Termination “B”

Capacitance Range (X8R Dielectric)

SIZE

LD03

LD05

LD06

WVDC

270

330

470

680

25V

G

50V

G

25V

50V

25V

50V

271

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

Cap

(pF)

J

N

J

N

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

Cap

(µF)

J

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

LD03

LD05

LD06

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

1.40

(0.055)

PAPER

EMBOSSED

32

MLCC Tin/Lead Termination “B”

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

16

25

50

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100 200

500

Cap

(pF)

100

150

220

330

470

680

C

G

J

N

J

N

J

N

J

N

K

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

K

J

P

Q

J

M

P

C

Cap

(µF

J

P

G

M

P

N

G

J

C*

G

M

Q

G

N

N*

J

M

Q

J*

M

P

Q

M

Q

J*

1.5

2.2

J*

P*

3.3

4.7

10

P*

Q*

P*

22

Q*

47

100

WVDC

16

25

50

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100

200

6.3

10

16

25

50

100 200

500

SIZE

LD02

LD03

LD05

LD06

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

1.02

(0.040)

1.52

(0.060)

2.79

(0.110)

PAPER

EMBOSSED

= Under Development

33

MLCC Tin/Lead Termination “B”

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD10

LD12

LD13

LD20

LD14

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

mm

(in.)

3.20 0.20

4.50 0.30

5.70 0.40

5.72 0.25

(L) Length

(0.126 0.008)

(0.177 0.012)

(0.225 0.016)

(0.225 0.010)

mm

(in.)

2.50 0.20

(0.098 0.008)

3.20 0.20

(0.126 0.008)

6.40 0.40

(0.252 0.016)

5.00 0.40

(0.197 0.016)

6.35 0.25

(0.250 0.010)

(W) Width

mm

(in.)

0.50 0.25

(0.020 0.010)

0.61 0.36

(0.024 0.014)

0.61 0.36

(0.024 0.014)

0.64 0.39

(0.025 0.015)

0.64 0.39

(0.025 0.015)

(t) Terminal

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

25

50

100

200

50

100

Cap

(pF)

100

150

220

W

L

᭢

330

470

T

᭢

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

t

J

M

N

X

Z

J

M

N

X

Z

J

M

P

Z

J

M

X

Z

J

M

P

Cap

(µF

K

M

Z

K

M

P

Q

X

K

P

X

K

P

X

Z

M

P

X

Z

X

Z

X

M

P

X

Q

J

M

Z

M

P

Q

X

Z

P

1.5

2.2

3.3

4.7

10

22

Z

47

100

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

25

50

100

200

50

100

SIZE

LD10

LD12

LD13

LD20

LD14

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

2.54

(0.100)

PAPER

EMBOSSED

34

MLCC Tin/Lead Termination “B”

Capacitance Range (X5R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

LD10

LD12

Soldering

Packaging

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

mm

(in.)

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

mm

(in.)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

2.50 0.20

(0.098 0.008)

(W) Width

mm

(in.)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

4

6.3 10 16 25 35 50 6.3 10 25 50

Cap

(pF)

100

150

220

C

330

470

680

C

W

L

᭢

T

᭢

1000

1500

2200

C

t

3300

4700

6800

C

G

Cap

(µF)

0.010

0.015

0.022

C

G

C

N

0.033

0.047

0.068

C

G

N

0.10

0.15

0.22

C

G

N

C*

C* C*

G

Q

0.33

0.47

0.68

G

N

Q

X

1.0

1.5

2.2

C* C* C*

C* C*

G

J*

N

P*

Q

X

Z

X

G* G* J* J*

N

Q

3.3

4.7

10

J* J* J* J*

J* J* J*

K* J*

N

Q

E*

N* N*

Q

Q*

Q

Z

N* N* N*

*

X

Z

22

47

P*

*

Q* Q* Q*

Q*

Z

Z*

Z

100

Z* Z*

6.3 10 16 25 35 50 6.3 10 25 50

WVDC

4

6.3 10 16 25 50

4

6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50

4

SIZE

LD02

LD03

LD05

LD06

LD10

LD12

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

= Under Development

= *Optional Specifications – Contact factory

NOTE: Contact factory for non-specified capacitance values

35

MLCC Low Profile

General Specifications

GENERAL DESCRIPTION

AVX introduces the LT series comprising a range of low profile

products in our X5R and X7R dielectric. X5R is a Class II dielectric

with temperature varation of capacitance within 15ꢀ from –55ꢁC to

+85ꢁC. Offerings include 0201, 0402, 0603, 0805 1206, and 1210

packages in compact, low profile designs. The LT series is ideal for

decoupling and filtering applications where height clearance is limited.

AVX is also expanding the low profile products in our X7R dielectric.

X7R is a Class II dielectric with temperature variation of capacitance

within 15ꢀ from -55ºC to +125ºC. Please contact the factory for

availability of any additional values not listed.

PART NUMBER (see page 2 for complete part number explanation)

LT05

Z

D

475

K

A

T

2

S

Size

Voltage

4V = 4

6.3V = 6

10V = Z

16V = Y

25V = 3

Dielectric

X5R = D

X7R = C

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Special

Code

See table below

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = 10ꢀ

M = 20ꢀ

LT01 - 0201

LT02 - 0402

LT03 - 0603

LT05 - 0805

LT06 - 1206

LT10 - 1210

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Contact

Factory

For

Multiples

NOTE: Contact factory for availability of tolerance options for specific part numbers.

SIZE

LT01

LT02

LT03

LT05

LT06

LT10

WVDC

4

Z

4

6.3

10

S

16

S

4

6.3

16

25

6.3

10

16

X

25

X

10

16

25

16

25

Cap

(µF)

104

0.10

0.22

0.47

1.0

Q

X

105

C

S

X

1.5

2.2

S

X

4.7

S

W

25

W

106

10

X/W

X

22

47

WVDC

4

6.3

10

16

4

6.3

16

25

6.3

10

16

25

10

16

25

SIZE

LT01

LT02

LT03

LT05

LT06

LT10

= X7R

Letter

Max.

Thickness (0.006)

J

0.15

Z

0.22

(0.009)

Q

0.25

(0.010)

C

0.36

(0.014)

S

0.56

(0.022)

X

0.95

(0.038)

W

1.02

(0.040)

EMBOSSED

PAPER

36

UltraThin Ceramic Capacitors

UT023D103MAT2C

The Ultrathin (UT) series of ceramic capacitors is a new product offering from AVX. The UT

series was designed to meet the stringent thickness requirements of our customers. AVX

developed a new termination process (FCT - Fine Copper Termination) that provides

unbeatable flatness and repeatability. The series includes products ꢂ 0.35mm in height

and is targeted for applications such as Smart cards, Memory modules, High Density SIM

cards, Mobile phones, MP3 players, and embedded solutions.

HOW TO ORDER

UT

02

3

D

103

M

A

T

2

C

Style

Ultra

Thin

Case

Size

0402

Rated

Voltage

25V

Temperature

Characteristic

X5R

Coded

Cap

0.01µF

Cap

Tolerance

20%

Termination

Style

Commercial

Termination

100ꢀ Sn

Packaging

7" Reel = 15,000 pcs

13" Reel = 50,000 pcs

Thickness

0.30mm max

RECOMMENDED SOLDER

PAD DIMENSIONS

L

BL

mm (inches)

W

L

BL

0.50

0.60

Top View

(0.020)

(0.024)

End View

T

Side View

0.50

(0.020)

PART DIMENSIONS

mm (inches)

L

W

T

BL

0.25 0.10

(0.010 0.004)

1.70

(0.067)

1.00 0.10

(0.039 0.004)

0.50 0.10

(0.020 0.004)

0.25 0.05

(0.010 0.002)

Temperature Coefficient

20

15

10

5

0

-5

-10

-15

-20

-80

-60

-40

-20

0

20

40

60

80

100

Temperature ºC

PERFORMANCE CHARACTERISTICS

Capacitance Value

0.01µF

Capacitance Tolerance

Dissipation Factor Range

Operating Temperature

Temperature Coefficient

Rated Voltage

20ꢀ

3.0ꢀ

-55ꢁC to +85ꢁC

15ꢀ

25V

Insulation Resistance at 25ºC and Rated Voltage 100,000 Mohms

Test Frequency 1 Vrms ꢄ 1 KHz

37

Automotive MLCC

Automotive

GENERAL DESCRIPTION

AVX Corporation has supported the Automotive Industry requirements for

Multilayer Ceramic Capacitors consistently for more than 10 years. Products

have been developed and tested specifically for automotive applications and

all manufacturing facilities are QS9000 and VDA 6.4 approved.

As part of our sustained investment in capacity and state of the art

technology, we are now transitioning from the established Pd/Ag electrode

system to a Base Metal Electrode system (BME).

AVX is using AECQ200 as the qualification vehicle for this transition. A detailed

qualification package is available on request and contains results on a range

of part numbers including:

• X7R dielectric components containing BME electrode and copper

terminations with a Ni/Sn plated overcoat.

• X7R dielectric components, BME electrode with epoxy finish for conductive

glue mounting.

• X7R dielectric components BME electrode and soft terminations with a

Ni/Sn plated overcoat.

• NP0 dielectric components containing Pd/Ag electrode and silver termina-

tion with a Ni/Sn plated overcoat.

HOW TO ORDER

0805

5

A

104

K

4

2

A

T

Size

0402

0603

0805

1206

1210 100V = 1

1812 200V = 2

500V = 7

Voltage Dielectric

Capacitance

Code (In pF)

2 Significant

Digits + Number

of Zeros

Capacitance

Tolerance

F = 1ꢀ

(≥10pF)*

Failure Rate

4 = Automotive

Packaging

2 = 7" Reel

4 = 13" Reel

Special Code

A = Std. Product

Terminations

T = Plated Ni and Sn

Z = FLEXITERM^®**

10V = Z

16V = Y

25V = 3

50V = 5

NP0 = A

X7R = C

X8R = F

U = Conductive Epoxy**

G = 2ꢀ

(≥10pF)*

e.g. 10µF = 106

**X7R & X8R only

J = 5ꢀ

(≤1µF)

K = 10ꢀ

M = 20ꢀ

*NPO only

Contact factory for availability of Tolerance Options for Specific Part Numbers.

NOTE: Contact factory for non-specified capacitance values.

0402 case size available in T termination only.

COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON

Commercial

Automotive

Administrative

Design

Standard Part Numbers.

Specific Automotive Part Number. Used to control

supply of product to Automotive customers.

No restriction on who purchases these parts.

Minimum ceramic thickness of 0.020"

Side & End Margins = 0.003" min

As per EIA RS469

Minimum Ceramic thickness of 0.029" (0.74mm)

on all X7R product.

Dicing

Side & End Margins = 0.004" min

Cover Layers = 0.005" min

Lot Qualification

(Destructive Physical

Analysis - DPA)

Increased sample plan –

stricter criteria.

Visual/Cosmetic Quality

Application Robustness

Standard process and inspection

100% inspection

Standard sampling for accelerated

wave solder on X7R dielectrics

Increased sampling for accelerated wave solder on

X7R and NP0 followed by lot by lot reliability testing.

All Tests have Accept/Reject Criteria 0/1

38

Automotive MLCC

NP0/X7R Dielectric

FLEXITERM^®FEATURES

a) Bend Test

b) Temperature Cycle testing

The capacitor is soldered to the PC Board as shown:

FLEXITERM^®has the ability to withstand at least 1000

cycles between –55ꢁC and +125ꢁC

1mm/sec

90 mm

Typical bend test results are shown below:

Style

Conventional Term

Soft Term

0603

0805

1206

ꢃ2mm

ꢃ5

ELECTRODE AND TERMINATION OPTIONS

NP0 DIELECTRIC

NP0 Ag/Pd Electrode

Nickel Barrier Termination

PCB Application

Sn

Ni

Ag

Figure 1 Termination Code T

X7R DIELECTRIC

X7R Nickel Electrode

X7R Dielectric

Soft Termination

PCB Application

Ni

Cu

Sn

Ni

Epoxy

Ni

Sn

Cu

Figure 2 Termination Code T

Figure 3 Termination Code Z

Conductive Epoxy Termination

Hybrid Application

Ni

Cu

Termination

Conductive

Epoxy

Figure 4 Termination Code U

39

Automotive MLCC-NP0

Capacitance Range

0603

0805

1206

100V

J

M

Q

1210

1812

25V

G

50V

G

100V

G

25V

J

50V

J

100V

J

25V

J

50V

J

M

200V

J

M

500V

25V

50V

100V

200V

50V

100V

100

120

150

180

220

270

330

390

470

510

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

103

10pF

12

15

18

22

27

33

39

47

51

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

10nF

J

M

P

M

K

P

25V

50V

100V

25V

50V

100V

25V

50V

100V

200V

500V

25V

50V

100V

200V

50V

100V

0603

0805

1206

1210

1812

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

2.54

(0.100)

PAPER

EMBOSSED

= Under Development

40

Automotive MLCC-X7R

Capacitance Range

0402

0603

0805

1206

1210

1812

2220

16V 25V 50V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V

221 Cap .22

271 (nF) .27

331

391

471

561

681

821

102

182

222

332

472

103

123

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

684

105 Cap

.33

.39

.47

.56

.68

.82

1

1.8

2.2

3.3

4.7

10

12

15

18

22

27

33

47

56

G

J

M

Q

J

M

P

Q

J

K

M

P

X

K

M

P

Q

Z

K

M

P

Q

Z

K

M

P

Q

X

K

M

X

K

M

X

J

M

J

M

Q

68

82

100

120

150

220

330

470

680

1

M

J

M

N

M

Q

X

Z

X

Z

155 (µF) 1.5

225

335

475

106

226

2.2

3.3

4.7

10

Z

X

Z

22

Z

16V 25V 50V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V

0402

0603

0805

1206

1210

1812

2220

= Under Development

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

1.02

(0.040)

PAPER

EMBOSSED

41

Automotive MLCC-X8R

Capacitance Range

SIZE

0603

0805

1206

WVDC

270

330

470

680

25V

G

50V

G

25V

50V

25V

50V

271

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

Cap

(pF)

J

N

J

N

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

Cap

(µF)

J

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

PAPER

EMBOSSED

= AEC-Q200 Qualified

42

APS Series

APS for COTS+ Applications

GENERAL DESCRIPTION

As part of our continuing support to high reliability customers, AVX

has launched an Automotive Plus Series of parts (APS) qualified and manufactured

in accordance with automotive AEC-Q200 standard. Each production batch is qual-

ity tested to an enhanced requirement and shipped with a certificate of conformance.

On a quarterly basis a reliability package is issued to all APS customers.

A detailed qualification package is available on request and contains results on a

range of part numbers including:

• X7R dielectric components containing BME electrode and copper terminations

with a Ni/Sn plated overcoat.

• X7R dielectric components BME electrode and soft terminations with a Ni/Sn

plated overcoat (FLEXITERM^®).

• X7R for Hybrid applications.

• NP0 dielectric components containing Pd/Ag electrode and silver termination with

a Ni/Sn plated overcoat.

We are also able to support customers who require an AEC-Q200 grade component

finished with Tin/Lead.

HOW TO ORDER

AP03

5

A

104

K

Q

2

A

T

Size

Voltage Dielectric

Capacitance

Code (In pF)

2 Significant Digits +

Number of Zeros

e.g. 10µF = 106

Capacitance Failure Rate

Packaging

2 = 7" Reel

4 = 13" Reel

Special Code

A = Std. Product

Terminations

T = Plated Ni and Sn**

Z = FLEXITERM^®**

U = Conductive Epoxy**

B = 5ꢀ min lead

Tolerance

J = 5ꢀ

AP03=0603

AP05=0805

AP06=1206

16V = Y

25V = 3

50V = 5

NP0 = A

X7R = C

Q = APS

K = 10ꢀ

M = 20ꢀ

AP10=1210 100V = 1

AP12=1812 200V = 2

500V = 7

X = FLEXITERM^®with

5ꢀ min lead

Z, U, X for X7R only

**RoHS compliant

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

43

NP0 Automotive Plus Series / APS

Capacitance Range

0603

0805

1206

100V

J

M

Q

1210

1812

25V

G

50V

G

100V

G

25V

J

50V

J

100V

J

25V

J

50V

J

M

200V

J

500V

25V

50V

100V

200V

50V

100V

100

120

150

180

220

270

330

390

470

510

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

103

10pF

12

15

18

22

27

33

39

47

51

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

10nF

J

M

P

M

K

P

25V

50V

100V

25V

50V

100V

25V

50V

100V

200V

500V

25V

50V

100V

200V

50V

100V

0603

0805

1206

1210

1812

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

2.54

(0.100)

PAPER

EMBOSSED

AEC-Q200 qualified

TS 16949, ISO 9001 certified

44

X7R Automotive Plus Series / APS

Capacitance Range

0603

0805

1206

1210

1812

2220

16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V

102 Cap

182 (nF) 1.8

1

G

J

M

Q

J

M

P

Q

J

K

M

P

X

K

M

P

Q

Z

K

M

P

Q

Z

K

M

P

Q

X

K

M

X

K

M

X

222

332

472

103

123

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

684

105 Cap

2.2

3.3

4.7

10

12

15

18

22

27

33

47

56

68

82

100

120

150

220

330

470

680

1

J

M

J

M

Q

M

J

M

N

M

Q

X

Z

X

Z

155 (µF) 1.5

225

335

475

106

226

2.2

3.3

4.7

10

Z

X

Z

22

Z

16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V

0603

0805

1206

1210

1812

2220

= Under Development

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

PAPER

EMBOSSED

AEC-Q200 qualified

TS 16949, ISO 9001 certified

45

MLCC with FLEXITERM^®

General Specifications

GENERAL DESCRIPTION

With increased requirements from the automotive industry for additional

component robustness, AVX recognized the need to produce a MLCC with

enhanced mechanical strength. It was noted that many components may be

subject to severe flexing and vibration when used in various under the hood

automotive and other harsh environment applications.

To satisfy the requirement for enhanced mechanical strength, AVX had to

find a way of ensuring electrical integrity is maintained whilst external forces

are being applied to the component. It was found that the structure of the

termination needed to be flexible and after much research and development,

AVX launched FLEXITERM^®. FLEXITERM^®is designed to enhance the

mechanical flexure and temperature cycling performance of a standard

ceramic capacitor with an X7R dielectric. The industry standard for

flexure is 2mm minimum. Using FLEXITERM^®, AVX provides up to

5mm of flexure without internal cracks. Beyond 5mm, the capacitor

will generally fail “open”.

As well as for automotive applications FLEXITERM^®will provide Design

Engineers with a satisfactory solution when designing PCB’s which may be

subject to high levels of board flexure.

APPLICATIONS

High Flexure Stress Circuit Boards

• e.g. Depanelization: Components near edges

of board.

PRODUCT ADVANTAGES

• High mechanical performance able to withstand, 5mm bend test

guaranteed.

• Increased temperature cycling performance, 3000 cycles and beyond.

• Flexible termination system.

• Reduction in circuit board flex failures.

Variable Temperature Applications

• Soft termination offers improved reliability per-

formance in applications where there is tem-

perature variation.

• e.g. All kind of engine sensors: Direct

connection to battery rail.

Automotive Applications

• Base metal electrode system.

• Automotive or commercial grade products available.

• Improved reliability.

• Excellent mechanical performance and

thermo mechanical performance.

HOW TO ORDER

0805

5

C

104

K

2

A

Z

Style

0603

0805

1206

1210

1812

2220

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Dielectric

C = X7R

F = X8R

Capacitance

Code (In pF)

Capacitance

Tolerance

J = 5ꢀ*

K = 10ꢀ

M = 20ꢀ

Packaging

2 = 7" reel

4 = 13" reel

Special Code

A = Std. Product

Failure

Rate

A=Commercial

4 = Automotive

Terminations

Z = FLEXITERM^®

2 Sig Digits +

For FLEXITERM^®

with Tin/Lead

termination see

AVX LD Series

Number of Zeros

e.g., 104 = 100nF

*≤1µF only

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

46

MLCC with FLEXITERM^®

Specifications and Test Methods

BOARD BEND TEST PROCEDURE

PERFORMANCE TESTING

According to AEC-Q200

AEC-Q200 Qualification:

• Created by the Automotive Electronics

Council

Test Procedure as per AEC-Q200:

Sample size:

Span: 90mm

20 components

LOADING

KNIFE

Minimum deflection spec: 2 mm

• Specification defining stress

test qualification for

passive components

• Components soldered onto FR4 PCB (Figure 1)

• Board connected electrically to the test equipment

(Figure 2)

MOUNTING

ASSEMBLY

DIGITAL

CALIPER

Testing:

BEND TESTPLATE

Key tests used to compare

soft termination to

AEC-Q200 qualification:

• Bend Test

CONNECTOR

CONTROL

PANEL

CONTROL PANEL

• Temperature Cycle Test

Fig 2 - Board Bend test

equipment

Fig 1 - PCB layout with electrical connections

BOARD BEND TEST RESULTS

AEC-Q200 Vrs AVX FLEXITERM^®Bend Test

0603

0805

12

10

8

6

4

2

12

10

8

6

4

2

AVX ENHANCED SOFT

TERMINATION BEND TEST

PROCEDURE

0

NPO

X7R

X7R soft term

NPO

X7R

X7R soft term

Bend Test

The capacitor is soldered to the printed circuit

board as shown and is bent up to 10mm at

1mm per second:

1210

1206

12

10

8

12

10

8

6

4

2

0

6

4

2

0

Max. = 10mm

NPO

X7R

X7R soft term

NPO

X7R

X7R soft term

TABLE SUMMARY

90mm

Typical bend test results are shown below:

Style

0603

0805

1206

Conventional Termination

FLEXITERM^®

ꢃ5mm

ꢃ2mm

• The board is placed on 2 supports 90mm

apart (capacitor side down)

• The row of capacitors is aligned with the

load stressing knife

ꢃ5mm

TEMPERATURE CYCLE TEST PROCEDURE

Test Procedure as per AEC-Q200:

Max. = 10mm

The test is conducted to determine the resistance of the

component when it is exposed to extremes of alternating

high and low temperatures.

• Sample lot size quantity 77 pieces

• TC chamber cycle from -55ºC to +125ºC for 1000 cycles

• Interim electrical measurements at 250, 500, 1000 cycles

• Measure parameter capacitance dissipation factor,

insulation resistance

• The load is applied and the deflection where

the part starts to crack is recorded (Note:

Equipment detects the start of the crack

using a highly sensitive current detection

circuit)

Test Temperature Profile (1 cycle)

+125⁰

+25⁰

C

• The maximum deflection capability is 10mm

-55⁰

C

1 hour 12mins

47

MLCC with FLEXITERM^®

Specifications and Test Methods

BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS

0603

0805

10

8

10

8

6

4

2

0

500 1000 1500 2000 2500 3000

0

500 1000 1500 2000 2500 3000

1206

1210

10

8

10

8

6

4

2

0

500 1000 1500 2000 2500 3000

0

500 1000 1500 2000 2500 3000

AEC-Q200 specification states

1000 cycles compared to AVX

3000 temperature cycles.

Soft Term - No Defects up to 3000 cycles

FLEXITERM^®TEST SUMMARY

• Qualified to AEC-Q200 test/specification with the exception • Board bend test improvement by a factor of 2 to 4 times.

of using AVX 3000 temperature cycles (up to +150ꢁC bend

• Temperature Cycling:

test guaranteed greater than 5mm).

– 0ꢀ Failure up to 3000 cycles

• FLEXITERM^®provides improved performance compared to

– No ESR change up to 3000 cycles

standard termination systems.

WITHOUT SOFT TERMINATION

WITH SOFT TERMINATION

Major fear is of latent board flex failures.

Far superior mechanical performance.

Generally open failure mode beyond

5mm flexure.

48

MLCC with FLEXITERM^®

X8R Dielectric Capacitance Range

SIZE

0603

0805

1206

WVDC

270

330

470

680

25V

G

50V

G

25V

50V

25V

50V

271

331

471

681

102

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

684

824

105

Cap

(pF)

J

N

J

N

1000

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.01

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.1

J

Cap

(µF)

J

M

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.68

0.82

1

WVDC

25V

50V

25V

50V

25V

50V

SIZE

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.90

(0.035)

J

0.94

(0.037)

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

PAPER

EMBOSSED

= AEC-Q200 Qualified

49

MLCC with FLEXITERM^®

X7R Dielectric Capacitance Range

0603

0805

1206

1210

1812

2220

16V

25V

50V 100V 200V 10V

16V

25V

50V

100V 200V 16V

25V

50V

100V 200V 16V

25V

50V

100V 16V

25V

50V 100V 25V

50V 100V

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

155

185

225

335

475

106

226

J

N

J

P

Q

J

M

N

K

M

P

Q

X

J

M

P

Q

K

M

P

Z

K

M

P

Q

X

Z

K

M

P

Q

X

Z

K

M

X

K

M

X

K

M

X

Z

K

M

X

Z

X

J

M

N

M

N

M

Q

M

Q

X

Z

X

Z

X

Z

X

Z

16V

25V

50V 100V 200V 10V

16V

25V

50V

100V 200V 16V

25V

50V

100V 200V 16V

25V

50V

100V 16V

25V

50V 100V 25V

50V 100V

0603

0805

1206

1210

1812

2220

Letter

Max.

Thickness (0.013)

A

0.33

C

0.56

(0.022)

E

0.71

(0.028)

G

0.90

(0.035)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

Y

2.54

(0.100)

Z

2.79

(0.110)

0.94

(0.037)

2.29

(0.090)

PAPER

EMBOSSED

50

FLEXISAFE MLC Chips

For Ultra Safety Critical Applications

AVX have developed a range of components specifically for safety

critical applications.

Utilizing the award-winning FLEXITERM™ layer in conjunction with

the cascade design previously used for high voltage MLCCs, a

range of ceramic capacitors is now available for customers who

require components designed with an industry leading set of

safety features.

The FLEXITERM™ layer protects the component from any

damage to the ceramic resulting from mechanical stress during

PCB assembly or use with end customers. Board flexure type

mechanical damage accounts for the majority of MLCC failures.

The addition of the cascade structure protects the component

from low insulation resistance failure resulting from other common

causes for failure; thermal stress damage, repetitive strike ESD

damage and placement damage. With the inclusion of the

cascade design structure to complement the FLEXITERM™ layer,

the FLEXISAFE range of capacitors has unbeatable safety

features.

HOW TO ORDER

C

104

K

Q

Z

2

A

FS03

5

Dielectric

X7R = C

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

e.g. 10µF =106

Capacitance

Tolerance

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Failure

Rate

A = Commercial

4 = Automotive

Q = APS

Terminations

Z = FLEXITERM^TM

X = FLEXITERM^TM

with 5ꢀ

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std. Product

Size

Voltage

16V = Y

25V = 3

50V = 5

100V = 1

FS03 = 0603

FS05 = 0805

FS06 = 1206

FS10 = 1210

min lead

FLEXISAFE X7R RANGE

Capacitance

0603

25

0805

25

1206

25

1210

25

Code

102

182

222

332

472

103

123

153

183

223

273

333

473

563

683

823

104

124

154

224

334

474

nF

1

16

50

100

16

50

16

50

16

50

1.8

2.2

3.3

4.7

10

12

15

18

22

27

33

47

56

68

82

100

120

150

220

330

470

Qualified

In Qualification

51

Capacitor Array

Capacitor Array (IPC)

BENEFITS OF USING CAPACITOR

ARRAYS

AVX capacitor arrays offer designers the opportunity to

lower placement costs, increase assembly line output

through lower component count per board and to reduce

real estate requirements.

For high volume users of cap arrays using the very latest

placement equipment capable of placing 10 components per

second, the increase in throughput can be very significant and

can have the overall effect of reducing the number of place-

ment machines required to mount components:

Reduced Costs

Placement costs are greatly reduced by effectively placing

one device instead of four or two. This results in increased

throughput and translates into savings on machine time.

Inventory levels are lowered and further savings are made

on solder materials, etc.

If 120 million 2-element arrays or 40 million 4-element arrays

were placed in a year, the requirement for placement

equipment would be reduced by one machine.

During a 20Hr operational day a machine places 720K

components. Over a working year of 167 days the machine

can place approximately 120 million. If 2-element arrays are

mounted instead of discrete components, then the number

of placements is reduced by a factor of two and in the

scenario where 120 million 2-element arrays are placed there

is a saving of one pick and place machine.

Space Saving

Space savings can be quite dramatic when compared to

the use of discrete chip capacitors. As an example, the

0508 4-element array offers a space reduction of ꢃ40ꢀ vs.

4 x 0402 discrete capacitors and of ꢃ70ꢀ vs. 4 x 0603

discrete capacitors. (This calculation is dependent on the

spacing of the discrete components.)

Smaller volume users can also benefit from replacing

discrete components with arrays. The total number of place-

ments is reduced thus creating spare capacity on placement

machines. This in turn generates the opportunity to increase

overall production output without further investment in new

equipment.

Increased Throughput

Assuming that there are 220 passive components placed in a

mobile phone:

A reduction in the passive count to 200 (by replacing

discrete components with arrays) results in an increase in

throughput of approximately 9ꢀ.

A reduction of 40 placements increases throughput by 18ꢀ.

W2A (0508) Capacitor Arrays

4 pcs 0402 Capacitors

=

1 pc 0508 Array

1.88

(0.074)

1.4

1.0

(0.055) (0.039)

5.0 (0.197)

AREA = 7.0mm (0.276 in )

2.1 (0.083)

AREA = 3.95mm (0.156 in )

2

The 0508 4-element capacitor array gives a PCB space saving of over 40ꢀ

vs four 0402 discretes and over 70ꢀ vs four 0603 discrete capacitors.

W3A (0612) Capacitor Arrays

4 pcs 0603 Capacitors

=

1 pc 0612 Array

2.0

(0.079)

2.3

(0.091)

1.5

(0.059)

6.0 (0.236)

AREA = 13.8mm (0.543 in )

3.2 (0.126)

AREA = 6.4mm (0.252 in )

2

The 0612 4-element capacitor array gives a PCB space saving of over 50ꢀ

vs four 0603 discretes and over 70ꢀ vs four 0805 discrete capacitors.

52

Capacitor Array

Capacitor Array (IPC)

GENERAL DESCRIPTION

AVX is the market leader in the development and manufacture of

capacitor arrays. The smallest array option available from AVX, the

0405 2-element device, has been an enormous success in the

Telecommunications market. The array family of products also

includes the 0612 4-element device as well as 0508 2-element and

4-element series, all of which have received widespread acceptance

in the marketplace.

0405 - 2 Element

0508 - 4 Element

AVX capacitor arrays are available in X5R, X7R and NP0 (C0G)

ceramic dielectrics to cover a broad range of capacitance values.

Voltage ratings from 6.3 Volts up to 100 Volts are offered. AVX

also now offers a range of automotive capacitor arrays qualified to

AEC-Q200 (see separate table).

0508 - 2 Element

0612 - 4 Element

Key markets for capacitor arrays are Mobile and Cordless Phones,

Digital Set Top Boxes, Computer Motherboards and Peripherals

as well as Automotive applications, RF Modems, Networking

Products, etc.

AVX Capacitor Array - W2A41A***K

S21 Magnitude

0

-5

-10

-15

-20

-25

5pF

10pF

22pF

39pF

15pF

33pF

68pF

-30

-35

-40

0.01

0.1

1

10

Frequency (GHz)

HOW TO ORDER

W

2

A

4

3

C

103

M

2A

A

T

Style

W = RoHS

L = SnPb

Case Array Number Voltage Dielectric Capacitance Capacitance

Packaging &

Quantity

Code

Failure

Rate

A = Commercial

4 = Automotive

Termination

Code

Size

of Caps

Code

2 Sig Digits +

Number of

Zeros

Tolerance

J = 5ꢀ

6 = 6V

A = NP0

C = X7R

D = X5R

T = Plated Ni

1 = 0405

2 = 0508

3 = 0612

5 = 0306

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

and Sn**

2A = 7" Reel

(4000)

K = 10ꢀ

M = 20ꢀ

Z = FLEXITERM^®**

B = 5ꢀ min lead

X = FLEXITERM^®with

5ꢀ min lead

4A = 13" Reel

(10000)

2F = 7" Reel

(1000)

**RoHS compliant

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

53

Capacitor Array

Capacitance Range – NP0/C0G

SIZE

# Elements

Soldering

0405

2

Reflow Only

All Paper

0508

2

Reflow/Wave

All Paper

0508

4

Reflow/Wave

Paper/Embossed

0612

4

Reflow/Wave

Paper/Embossed

Packaging

mm

(in.)

1.00 0.15

(0.039 0.006)

1.30 0.15

(0.051 0.006)

1.30 0.15

(0.051 0.006)

1.60 0.150

(0.063 0.006)

Length

mm

(in.)

1.37 0.15

(0.054 0.006)

2.10 0.15

(0.083 0.006)

2.10 0.15

(0.083 0.006)

3.20 0.20

(0.126 0.008)

Width

Max.

Thickness

mm

(in.)

0.66

(0.026)

0.94

(0.037)

0.94

(0.037)

1.35

(0.053)

WVDC

Cap 1.0

16

25

50

16

25

50

100

16

25

50

100

16

25

50

100

1R0

1R2

1R5

(pF)

1.2

1.5

1R8

2R2

2R7

1.8

2.2

2.7

3R3

3R9

4R7

3.3

3.9

4.7

5R6

6R8

8R2

5.6

6.8

8.2

100

120

150

10

12

15

180

220

270

18

22

27

330

390

470

33

39

47

560

680

820

56

68

82

101

121

151

100

120

150

181

221

271

180

220

270

331

391

471

330

390

470

561

681

821

560

680

820

102

122

152

1000

1200

1500

182

222

272

1800

2200

2700

332

392

472

3300

3900

4700

562

682

822

5600

6800

8200

54

Capacitor Array

Capacitance Range – X7R/X5R

SIZE

# Elements

Soldering

Packaging

Length

0306 0405050805080612

4

2

4

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

mm

(in.)

1.60 0.15

(0.063 0.006)

1.00 0.15

(0.039 0.006)

1.30 0.15

(0.051 0.006)

1.30 0.15

(0.051 0.006)

1.60 0.150

(0.063 0.006)

mm

(in.)

0.81 0.15

(0.032 0.006)

1.37 0.15

(0.054 0.006)

2.10 0.15

(0.083 0.006)

2.10 0.15

(0.083 0.006)

3.20 0.20

(0.126 0.008)

Width

Max.

Thickness

mm

(in.)

0.50

(0.020)

0.66

(0.026)

0.94

(0.037)

0.94

(0.037)

1.35

(0.053)

WVDC

6

10

16 25

6

10

16

25

50

6

10

16

25

50

100

6

10

16

25

50

100

6

10

16

25

50

100

101 Cap

121 (µF)

151

100

120

150

181

221

271

180

220

270

331

391

471

330

390

470

561

681

821

560

680

820

102

122

152

1000

1200

1500

182

222

272

1800

2200

2700

332

392

472

3300

3900

4700

562

682

822

5600

6800

8200

103 Cap

123 (µF)

153

0.010

0.012

0.015

183

223

273

0.018

0.022

0.027

333

393

473

0.033

0.039

0.047

563

683

823

0.056

0.068

0.082

104

124

154

0.10

0.12

0.15

184

224

274

0.18

0.22

0.27

334

474

564

0.33

0.47

0.56

684

824

105

0.68

0.82

1.0

125

155

185

1.2

1.5

1.8

225

335

475

2.2

3.3

4.7

106

226

476

107

10

22

47

100

= Currently available X7R

= Currently available X5R

= Under development X7R, contact factory for advance samples

= Under development X5R, contact factory for advance samples

55

Automotive Capacitor Array (IPC)

As the market leader in the development and manufacture of capacitor

arrays AVX is pleased to offer a range of AEC-Q200 qualified arrays to

compliment our product offering to the Automotive industry. Both the

AVX 0612 and 0508 4-element capacitor array styles are qualified to the

AEC-Q200 automotive specifications.

AEC-Q200 is the Automotive Industry qualification standard and a

detailed qualification package is available on request.

0508 - 4 Element

All AVX automotive capacitor array production facilities are certified to

ISO/TS 16949:2002.

0612 - 4 Element

HOW TO ORDER

Y

C

104

K

4

T

3

A

4

2A

W

Voltage Dielectric Capacitance Capacitance Failure Rate

Case

Size

1 = 0405

2 = 0508

3 = 0612

Array

Packaging

& Quantity

Code

Style

W = RoHS

L = SnPb

Number

of Caps

Terminations

T = Plated Ni and Sn**

Z = FLEXITERM^®**

B = 5ꢀ min lead

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

A = NP0

C = X7R

F = X8R

Code (In pF)

Significant

Digits +

Tolerance

*J = 5ꢀ

4 = Automotive

2A = 7" Reel

(4000)

*K = 10ꢀ

M = 20ꢀ

X = FLEXITERM^®with

5ꢀ min lead

Number of

Zeros

4A = 13" Reel

(10000)

2F = 7" Reel

(1000)

e.g. 10µF=106

**RoHS compliant

*Contact factory for availability by part number for K = 10ꢀ and J = 5ꢀ tolerance.

NP0/C0G

X7R

X8R

SIZE

No. of Elements

0405 0508

0508

4

0612

4

SIZE

No. of Elements

0508

2

0508

4

0612

4

0405

2

WVDC

50

16

25

50

100

16

25

50

100

WVDC

10

16

25

50

100

16

25

50

100

10

16

25

50

100

16

1R0

1R2

1R5

Cap 1.0

(pF) 1.2

1.5

101

121

151

Cap 100

(pF) 120

150

1R8

2R2

2R7

1.8

2.2

2.7

181

221

271

180

220

270

3R3

3R9

4R7

3.3

3.9

4.7

331

391

471

330

390

470

5R6

6R8

8R2

5.6

6.8

8.2

561

681

821

560

680

820

100

120

150

10

12

15

102

122

152

1000

1200

1500

180

220

270

18

22

27

182

222

272

1800

2200

2700

330

390

470

33

39

47

332

392

472

3300

3900

4700

560

680

820

56

68

82

562

682

822

5600

6800

8200

101

121

151

100

120

150

103 Cap 0.010

123

153

(µF) 0.012

0.015

181

221

271

180

220

270

183

223

273

0.018

0.022

0.027

331

391

471

330

390

470

333

393

473

0.033

0.039

0.047

561

681

821

560

680

820

563

683

823

0.056

0.068

0.082

102

122

152

1000

1200

1500

104

124

154

0.10

0.12

0.15

182

222

272

332

392

472

562

682

822

1800

2200

2700

3300

3900

4700

5600

6800

8200

224

0.22

= X7R

= X8R

= Under development

= NPO/COG

= Under development

56

Capacitor Array

Multi-Value Capacitor Array (IPC)

GENERAL DESCRIPTION

A recent addition to the array product range is the Multi-

Value Capacitor Array. These devices combine two different

capacitance values in standard ‘Cap Array’ packages and

are available with a maximum ratio between the two

capacitance values of 100:1. The multi-value array is

currently available in the 0405 and 0508 2-element styles

and also in the 0612 4-element style.

ADVANTAGES OF THE MULTI-VALUE

CAPACITOR ARRAYS

Enhanced Performance Due to Reduced Parasitic

Inductance

When connected in parallel, not only do discrete capacitors

of different values give the desired self-resonance, but an

additional unwanted parallel resonance also results. This

parallel resonance is induced between each capacitor’s self-

resonant frequencies and produces a peak in impedance

response. For decoupling and bypassing applications this

peak will result in a frequency band of reduced decoupling

and in filtering applications reduced attenuation.

Whereas to date AVX capacitor arrays have been suited to

applications where multiple capacitors of the same value are

used, the multi-value array introduces a new flexibility to the

range. The multi-value array can replace discrete capacitors

of different values and can be used for broadband

decoupling applications. The 0508 x 2 element multi-value

array would be particularly recommended in this application.

Another application is filtering the 900/1800 or 1900MHz

noise in mobile phones. The 0405 2-element, low

capacitance value NP0, (C0G) device would be suited to this

application, in view of the space saving requirements of

mobile phone manufacturers.

The multi-value capacitor array, combining capacitors in one

unit, virtually eliminates the problematic parallel resonance,

by minimizing parasitic inductance between the capacitors,

thus enhancing the broadband decoupling/filtering

performance of the part.

Reduced ESR

An advantage of connecting two capacitors in parallel is a

significant reduction in ESR. However, as stated above,

using discrete components brings with it the unwanted side

effect of parallel resonance. The multi-value cap array is

an excellent alternative as not only does it perform the

same function as parallel capacitors but also it reduces the

uncertainty of the frequency response.

HOW TO ORDER (Multi-Value Capacitor Array - IPC)

W

2

A

2

Y

C

102M

104M

A

T

2A

1st Value

2nd Value

Style

Case

Size

1 = 0405

2 = 0508

3 = 0612

Array Number

of Caps

Voltage

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

Dielectric Capacitance Capacitance

Failure

Rate

Terminations

T = Plated Ni and Sn**

Z = FLEXITERM^®**

B = 5ꢀ min lead

Packaging &

Quantity

A = NP0

C = X7R

D = X5R

Code (In pF)

2 Sig. Digits +

No. of Zeros

Tolerance

K = 10ꢀ

M = 20ꢀ

Code

2A = 7" Reel (4000)

X = FLEXITERM^®with 4A = 13" Reel (10000)

5ꢀ min lead

2F = 7" Reel (1000)

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

**RoHS compliant

IMPEDANCE VS FREQUENCY

Cap (Min/Max)

1

0.8

0.6

0.4

0.2

0

NP0

X5R/X7R

221/104

101/103

2xDiscrete Caps (0603)

0612 4-element

0508 2-element

0405 2-element

100/471

100/101

• Max. ratio between the two cap values is 1:100.

Multi Value Cap (0508)

• The voltage of the higher capacitance value dictates

the voltage of the multi-value part.

• Only combinations of values within a specific dielectric

range are possible.

1

10

100

1000

Frequency (MHz)

57

Capacitor Array

PART & PAD LAYOUT DIMENSIONS

millimeters (inches)

0405 - 2 Element

PAD LAYOUT

0612 - 4 Element

PAD LAYOUT

W

E

X

P

D

S

P

S

A

B

T

C

C/L

OF CHIP

BW

C/L OF CHIP

C

L

C

L

BL

L

BL

L

0508 - 2 Element

PAD LAYOUT

0508 - 4 Element

PAD LAYOUT

E

W

P

D

W

D

S

X

A

S

P

A

B

C

T

C

BW

C/L OF CHIP

BW

C

L

C/L

OF CHIP

C

L

BL

L

BL

L

PART DIMENSIONS

PAD LAYOUT DIMENSIONS

0405 - 2 Element

L

W

1.37 0.15

T

BW

0.36 0.10

BL

0.20 0.10

P

0.64 REF

S

A

B

C

D

E

1.00 0.15

0.66 MAX

0.32 0.10

0.46

0.74

1.20

0.30

0.64

(0.039 0.006) (0.054 0.006) (0.026 MAX) (0.014 0.004) (0.008 0.004

)

(0.025 REF) (0.013 0.004)

(0.018)

(0.029)

(0.047)

(0.012)

(0.025)

0508 - 2 Element

L

W

2.10 0.15

T

BW

0.43 0.10

BL

0.33 0.08

P

1.00 REF

S

A

B

C

D

E

1.30 0.15

0.94 MAX

0.50 0.10

0.68

1.32

2.00

0.46

1.00

(0.051 0.006) (0.083 0.006) (0.037 MAX) (0.017 0.004) (0.013 0.003

(0.039 REF) (0.020 0.004)

(0.027)

(0.052)

(0.079)

(0.018)

(0.039)

0508 - 4 Element

L

W

2.10 0.15

T

BW

0.25 0.06

BL

0.20 0.08

P

0.50 REF

X

S

A

B

C

D

E

1.30 0.15

0.94 MAX

0.75 0.10

0.25 0.10

0.56

1.32

1.88

0.30

0.50

(0.051 0.006) (0.083 0.006) (0.037 MAX) (0.010 0.003) (0.008 0.003

(0.020 REF) (0.030 0.004) (0.010 0.004)

(0.022)

(0.052)

(0.074)

(0.012)

(0.020)

0612 - 4 Element

A

B

C

D

E

L

W

T

BW

BL

P

X

S

+0.25

0.89

1.65

2.54

0.46

0.76

1.60 0.20

3.20 0.20

1.35 MAX

0.41 0.10

0.18

0.76 REF

1.14 0.10

0.38 0.10

-0.08

(0.035)

(0.065)

(0.100)

(0.018)

(0.030)

+0.010

(0.063 0.008) (0.126 0.008) (0.053 MAX) (0.016 0.004) (0.007

)

(0.030 REF) (0.045 0.004) (0.015 0.004)

-0.003

58

Low Inductance Capacitors

Introduction

The signal integrity characteristics of a Power Delivery

Network (PDN) are becoming critical aspects of board level

and semiconductor package designs due to higher operating

frequencies, larger power demands, and the ever shrinking

lower and upper voltage limits around low operating voltages.

These power system challenges are coming from mainstream

designs with operating frequencies of 300MHz or greater,

modest ICs with power demand of 15 watts or more, and

operating voltages below 3 volts.

capacitor, one resistor, and one inductor. The RLC values in

this model are commonly referred to as equivalent series

capacitance (ESC), equivalent series resistance (ESR), and

equivalent series inductance (ESL).

The ESL of a capacitor determines the speed of energy

transfer to a load. The lower the ESL of a capacitor, the faster

that energy can be transferred to a load. Historically, there

has been a tradeoff between energy storage (capacitance)

and inductance (speed of energy delivery). Low ESL devices

typically have low capacitance. Likewise, higher capacitance

devices typically have higher ESLs. This tradeoff between

ESL (speed of energy delivery) and capacitance (energy

storage) drives the PDN design topology that places the

fastest low ESL capacitors as close to the load as possible.

Low Inductance MLCCs are found on semiconductor

packages and on boards as close as possible to the load.

The classic PDN topology is comprised of a series of

capacitor stages. Figure 1 is an example of this architecture

with multiple capacitor stages.

An ideal capacitor can transfer all its stored energy to a load

instantly. A real capacitor has parasitics that prevent

instantaneous transfer of a capacitor’s stored energy. The

true nature of a capacitor can be modeled as an RLC

equivalent circuit. For most simulation purposes, it is possible

to model the characteristics of a real capacitor with one

Slowest Capacitors

Fastest Capacitors

Semiconductor Product

VR

Bulk

Board-Level

Package-Level

Die-Level

Low Inductance Decoupling Capacitors

Figure 1 Classic Power Delivery Network (PDN) Architecture

LOW INDUCTANCE CHIP CAPACITORS

INTERDIGITATED CAPACITORS

The key physical characteristic determining equivalent series

inductance (ESL) of a capacitor is the size of the current loop

it creates. The smaller the current loop, the lower the ESL. A

standard surface mount MLCC is rectangular in shape with

electrical terminations on its shorter sides. A Low Inductance

Chip Capacitor (LICC) sometimes referred to as Reverse

Geometry Capacitor (RGC) has its terminations on the longer

side of its rectangular shape.

The size of a current loop has the greatest impact on the ESL

characteristics of a surface mount capacitor. There is a

secondary method for decreasing the ESL of a capacitor.

This secondary method uses adjacent opposing current loops

to reduce ESL. The InterDigitated Capacitor (IDC) utilizes

both primary and secondary methods of reducing inductance.

The IDC architecture shrinks the distance between

terminations to minimize the current loop size, then further

reduces inductance by creating adjacent opposing current

loops.

When the distance between terminations is reduced, the size

of the current loop is reduced. Since the size of the current

loop is the primary driver of inductance, an 0306 with a

smaller current loop has significantly lower ESL then an 0603.

The reduction in ESL varies by EIA size, however, ESL is

typically reduced 60ꢀ or more with an LICC versus a

standard MLCC.

An IDC is one single capacitor with an internal structure that

has been optimized for low ESL. Similar to standard MLCC

versus LICCs, the reduction in ESL varies by EIA case size.

Typically, for the same EIA size, an IDC delivers an ESL that is

at least 80ꢀ lower than an MLCC.

59

Low Inductance Capacitors

Introduction

LAND GRID ARRAY (LGA) CAPACITORS

LOW INDUCTANCE CHIP ARRAYS (LICA^®)

Land Grid Array (LGA) capacitors are based on the first Low

ESL MLCC technology created to specifically address the

design needs of current day Power Delivery Networks (PDNs).

This is the 3rd low inductance capacitor technology

developed by AVX. LGA technology provides engineers with

new options. The LGA internal structure and manufacturing

technology eliminates the historic need for a device to be

physically small to create small current loops to minimize

inductance.

The LICA^®product family is the result of a joint development

effort between AVX and IBM to develop a high performance

MLCC family of decoupling capacitors. LICA was introduced

in the 1980s and remains the leading choice of designers in

high performance semiconductor packages and high

reliability board level decoupling applications.

LICA^®products are used in 99.999ꢀ uptime semiconductor

package applications on both ceramic and organic

substrates. The C4 solder ball termination option is the

perfect compliment to flip-chip packaging technology.

Mainframe class CPUs, ultimate performance multi-chip

modules, and communications systems that must have the

reliability of 5 9’s use LICA^®.

LICA^®products with either Sn/Pb or Pb-free solder balls are

used for decoupling in high reliability military and aerospace

applications. These LICA^®devices are used for decoupling of

large pin count FPGAs, ASICs, CPUs, and other high power

ICs with low operating voltages.

The first family of LGA products are 2 terminal devices. A

2 terminal 0306 LGA delivers ESL performance that is equal

to or better than an 0306 8 terminal IDC. The 2 terminal 0805

LGA delivers ESL performance that approaches the 0508

8 terminal IDC. New designs that would have used 8 terminal

IDCs are moving to 2 terminal LGAs because the layout is

easier for a 2 terminal device and manufacturing yield is better

for a 2 terminal LGA versus an 8 terminal IDC.

LGA technology is also used in a 4 terminal family of products

that AVX is sampling and will formerly introduce in 2008.

Beyond 2008, there are new multi-terminal LGA product

families that will provide even more attractive options for PDN

designers.

When high reliability decoupling applications require the very

lowest ESL capacitors, LICA^®products are the best option.

470 nF 0306 Impedance Comparison

1

0306 2T-LGA

0306 LICC

0306 8T-IDC

0603 MLCC

0.1

0.01

0.001

1

10

100

1000

Frequency (MHz)

Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).

60

Low Inductance Capacitors (RoHS)

0612/0508/0306/0204 LICC (Low Inductance Chip Capacitors)

GENERAL DESCRIPTION

The key physical characteristic determining equivalent

series inductance (ESL) of a capacitor is the size of the

current loop it creates. The smaller the current loop, the

lower the ESL.

A standard surface mount MLCC is rectangular in shape

with electrical terminations on its shorter sides. A Low

Inductance Chip Capacitor (LICC) sometimes referred to

as Reverse Geometry Capacitor (RGC) has its

terminations on the longer sides of its rectangular shape.

The image on the right shows the termination differences

between an MLCC and an LICC.

LICC

MLCC

When the distance between terminations is reduced, the

size of the current loop is reduced. Since the size of the

current loop is the primary driver of inductance, an 0306

with a smaller current loop has significantly lower ESL

then an 0603. The reduction in ESL varies by EIA size,

however, ESL is typically reduced 60ꢀ or more with an

LICC versus a standard MLCC.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerances K = 10ꢀ; M = 20ꢀ

Operation

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

Temperature Range

AVX LICC products are available with a lead-free finish of

plated Nickel/Tin.

Temperature Coefficient X7R, X5R = 15ꢀ; X7S = 22ꢀ

Voltage Ratings

4, 6.3, 10, 16, 25 VDC

Dissipation Factor

4V, 6.3V = 6.5ꢀ max; 10V = 5.0ꢀ max;

16V = 3.5ꢀ max; 25V = 3.0ꢀ max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

µF min.,whichever is less

HOW TO ORDER

0612

Z

D

105

M

A

T

2

A*

Size

0204

0306

0508

0612

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

W = X6S

Z = X7S

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = 10ꢀ

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

mm (in)

0.35 (0.014)

0.56 (0.022)

0.61 (0.024)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

A = N/A

T = Plated Ni

and Sn

M = 20ꢀ

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

TYPICAL IMPEDANCE CHARACTERISTICS

10

1

10

MLCC_0805

MLCC_1206

1

0.1

LICC_0508

LICC_0612

0.01

0.001

0.01

0.001

1

10

Frequency (MHz)

100

1000

1

10

100

1000

Frequency (MHz)

61

Low Inductance Capacitors (RoHS)

0612/0508/0306/0204 LICC (Low Inductance Chip Capacitors)

SIZE

0204

0306

0508

0612

PHYSICAL DIMENSIONS AND

PAD LAYOUT

Packaging

Embossed

mm

0.81 0.15

(0.032 0.006)

1.27 0.25

(0.050 0.010)

1.60 0.25

(0.063 0.010)

Length

(in.)

mm

(in.)

1.60 0.15

(0.063 0.006)

2.00 0.25

(0.080 0.010)

3.20 0.25

(0.126 0.010)

Width

t

WVDC

4

6.3 10 16

4

6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50

W

CAP 0.001

(µF)

0.0022

T

0.0047

0.010

0.015

0.022

0.047

0.068

0.10

0.15

0.22

0.47

0.68

1.0

L

PHYSICAL CHIP DIMENSIONS mm (in)

L

W

t

1.60 0.25

(0.063 0.010)

3.20 0.25

(0.126 0.010)

0.13 min.

(0.005 min.)

0612

0508

0306

0204

1.27 0.25

(0.050 0.010)

2.00 0.25

(0.080 0.010)

0.13 min.

(0.005 min.)

0.81 0.15

(0.032 0.006)

1.60 0.15

(0.063 0.006)

0.13 min.

(0.005 min.)

0.50 0.05

(0.020 0.002)

1.00 0.05

(0.040 0.002)

0.18 0.08

(0.007 0.003)

1.5

T - See Range Chart for Thickness and Codes

2.2

3.3

PAD LAYOUT DIMENSIONS

mm (in)

C

4.7

A

B

10

0612

0508

0306

0204

0.76 (0.030)

0.51 (0.020)

0.31 (0.012)

3.05 (0.120)

2.03 (0.080)

1.52 (0.060)

.635 (0.025)

0.51 (0.020)

Solid = X7R

= X6S

= X5R

= X7S

mm (in.)

0306

0204

0508

0612

Code Thickness

0.61 (0.024)

Code Thickness

A

C

0.35 (0.014)

S

V

A

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

S

V

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

W

A

“B”

C

“A”

C

62

Low Inductance Capacitors (SnPb)

0612/0508/0306/0204 Tin Lead Termination “B”

GENERAL DESCRIPTION

The key physical characteristic determining equivalent

series inductance (ESL) of a capacitor is the size of the

current loop it creates. The smaller the current loop, the

lower the ESL.

A standard surface mount MLCC is rectangular in shape

with electrical terminations on its shorter sides. A Low

Inductance Chip Capacitor (LICC) sometimes referred to

as Reverse Geometry Capacitor (RGC) has its

terminations on the longer sides of its rectangular shape.

The image on the right shows the termination differences

between an MLCC and an LICC.

LICC

MLCC

When the distance between terminations is reduced, the

size of the current loop is reduced. Since the size of the

current loop is the primary driver of inductance, an 0306

with a smaller current loop has significantly lower ESL

then an 0603. The reduction in ESL varies by EIA size,

however, ESL is typically reduced 60ꢀ or more with an

LICC versus a standard MLCC.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerances K = 10ꢀ; M = 20ꢀ

Operation

Temperature Range

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

AVX LICC products are available with a lead termination

for high reliability military and aerospace applications that

must avoid tin whisker reliability issues.

Temperature Coefficient X7R, X5R = 15ꢀ; X7S = 22ꢀ

Voltage Ratings

4, 6.3, 10, 16, 25 VDC

Dissipation Factor

4V, 6.3V = 6.5ꢀ max; 10V = 5.0ꢀ max;

16V = 3.5ꢀ max; 25V = 3.0ꢀ max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

µF min.,whichever is less

HOW TO ORDER

LD18

Z

D

105

M

A

B

2

A*

Size

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

W = X6S

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = 10ꢀ

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

mm (in)

0.35 (0.014)

0.56 (0.022)

0.61 (0.024)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

LD15 = 0204

LD16 = 0306

LD17 = 0508

LD18 = 0612

A = N/A

B = 5ꢀ min lead

M = 20ꢀ

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

TYPICAL IMPEDANCE CHARACTERISTICS

10

1

10

MLCC_0805

MLCC_1206

1

0.1

LICC_0508

LICC_0612

0.01

0.001

0.01

0.001

1

10

Frequency (MHz)

100

1000

1

10

100

1000

Frequency (MHz)

63

Low Inductance Capacitors (SnPb)

0612/0508/0306/0204 Tin Lead Termination “B”

PHYSICAL DIMENSIONS AND

PAD LAYOUT

PREFERRED SIZES ARE SHADED

SIZE

LD15

LD16

LD17

LD18

Soldering

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Packaging

mm

(L) Length

(in.)

Paper/Embossed

t

0.81 0.15

1.27 0.25

1.60 0.25

W

(0.032 0.006)

(0.050 0.010)

(0.063 0.010)

mm

(W) Width

(in.)

1.60 0.15

(0.063 0.006)

2.00 0.25

(0.080 0.010)

3.20 0.25

(0.126 0.010)

WVDC

4

6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50

T

Cap

(pF)

1000

2200

4700

0.010

0.015

0.022

0.047

0.068

0.10

0.15

0.22

0.47

0.68

1.0

A

S

V

A

S

V

A

S

V

A

S

V

A

V

A

S

V

W

A

S

V

W

A

S

V

S

V

Cap

(µF)

V

L

W

C

V

W

PHYSICAL CHIP DIMENSIONS mm (in)

V

W

A

L

W

t

1.60 0.25

(0.063 0.010)

3.20 0.25

(0.126 0.010)

0.13 min.

(0.005 min.)

1.5

2.2

3.3

4.7

0612

0508

0306

0204

1.27 0.25

(0.050 0.010)

2.00 0.25

(0.080 0.010)

0.13 min.

(0.005 min.)

10

0.81 0.15

(0.032 0.006)

1.60 0.15

(0.063 0.006)

0.13 min.

(0.005 min.)

WVDC

4

6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50

SIZE

0204

0306

0508

0612

0.50 0.05

(0.020 0.002)

1.00 0.05

(0.040 0.002)

0.18 0.08

(0.007 0.003)

Solid = X7R

= X6S

= X5R

= X7S

T - See Range Chart for Thickness and Codes

mm (in.)

LD16 - 0306

LD15 - 0204

LD17 - 0508

LD18 - 0612

Code Thickness

0.61 (0.024)

Code Thickness

PAD LAYOUT DIMENSIONS

mm (in)

C

A

C

0.35 (0.014)

S

V

A

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

S

V

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

A

B

0612

0508

0306

0204

0.76 (0.030)

0.51 (0.020)

0.31 (0.012)

3.05 (0.120)

2.03 (0.080)

1.52 (0.060)

.635 (0.025)

0.51 (0.020)

W

A

“B”

C

“A”

C

64

IDC Low Inductance Capacitors (RoHS)

0612/0508 IDC (InterDigitated Capacitors)

GENERAL DESCRIPTION

Inter-Digitated Capacitors (IDCs) are used for both semiconductor

package and board level decoupling. The equivalent series

inductance (ESL) of a single capacitor or an array of capacitors in

parallel determines the response time of a Power Delivery Network

(PDN). The lower the ESL of a PDN, the faster the response time.

A designer can use many standard MLCCs in parallel to reduce ESL

or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC

devices are available in versions with a maximum height of 0.95mm

or 0.55mm.

0612

0508

IDCs are typically used on packages of semiconductor products

+

–

+

–

with power levels of 15 watts or greater. Inter-Digitated Capacitors

are used on CPU, GPU, ASIC, and ASSP devices produced on

0.13µ, 90nm, 65nm, and 45nm processes. IDC devices are used

on both ceramic and organic package substrates. These low ESL

surface mount capacitors can be placed on the bottom side or the

top side of a package substrate. The low profile 0.55mm maximum

height IDCs can easily be used on the bottom side of BGA

packages or on the die side of packages under a heat spreader.

+

–

+

IDCs are used for board level decoupling of systems with speeds of

300MHz or greater. Low ESL IDCs free up valuable board space by

reducing the number of capacitors required versus standard

MLCCs. There are additional benefits to reducing the number of

capacitors beyond saving board space including higher reliability

from a reduction in the number of components and lower

placement costs based on the need for fewer capacitors.

TYPICAL IMPEDANCE

10

MLCC_1206

LICC_0612

1

The Inter-Digitated Capacitor (IDC) technology was developed by

AVX. This is the second family of Low Inductance MLCC products

created by AVX. IDCs are a cost effective alternative to AVX’s first

generation low ESL family for high-reliability applications known as

LICA (Low Inductance Chip Array).

0.1

IDC_0612

0.01

0.001

1

10

100

1000

AVX IDC products are available with a lead-free finish of plated

Nickel/Tin.

Frequency (MHz)

HOW TO ORDER

225

M

W

3

L

1

6

D

A

T

3

A

Capacitance Capacitance

Style

IDC

Case

Low

Inductance

Number Voltage Dielectric

Failure Termination Packaging

Thickness

Max. Thickness

mm (in.)

Code (In pF)

Tolerance

of

Rate

4 = 4V

C = X7R

D = X5R

Z = X7S

T = Plated Ni

and Sn

Available

Size

Terminals

1 = 8 Terminals

2 Sig. Digits + M = 20ꢀ

Number of

Zeros

A = N/A

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

1=7" Reel

3=13" Reel A=0.95 (0.037)

S=0.55 (0.022)

2 = 0508

3 = 0612

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerance

Operation

20ꢀ Preferred

Dielectric Strength

CTE (ppm/C)

No problems observed after 2.5 x RVDC

for 5 seconds at 50mA max current

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

15ꢀ (0VDC)

Temperature Range

12.0

Thermal Conductivity 4-5W/M K

Temperature Coefficient

Voltage Ratings

4, 6.3, 10, 16 VDC

Terminations

Available

Plated Nickel and Solder

0.037" (0.95mm)

Dissipation Factor

4V, 6.3V = 6.5ꢀ max;

10V = 5.0ꢀ max;

16V = 3.5ꢀ max

Max. Thickness

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

µF min.,whichever is less

65

IDC Low Inductance Capacitors (RoHS)

0612/0508 IDC (InterDigitated Capacitors)

SIZE

Thin 0508

0508

Thin 0612

0612

mm

(in.)

2.03 0.20

3.20 0.20

Length

(0.080 0.008)

(0.126 0.008)

mm

(in.)

1.27 0.20

(0.050 0.008)

1.27 0.20

(0.050 0.008)

1.60 0.20

(0.063 0.008)

1.60 0.20

(0.063 0.008)

Width

Terminal

Pitch

mm

(in.)

0.50 0.05

(0.020 0.002)

0.50 0.05

(0.020 0.002)

0.80 0.10

(0.031 0.004)

0.80 0.10

(0.031 0.004)

mm

(in.)

0.55 MAX.

(0.022) MAX.

0.95 MAX.

(0.037) MAX.

0.55 MAX.

(0.022) MAX.

0.95 MAX.

(0.037) MAX.

Thickness

WVDC

4

6.3

10

16

25

4

6.3

10

16

25

4

6.3

10

16

4

6.3

10

16

Cap

(µF)

0.01

0.033

0.047

0.068

0.10

0.22

0.33

0.47

0.68

1.0

Consult factory for

additional requirements

= X7R

= X5R

= X7S

1.5

2.2

3.3

PHYSICAL DIMENSIONS AND PAD LAYOUT

L

P

E

T

D

BW

A

B

C

BL

W

PAD LAYOUT

DIMENSIONS

PHYSICAL CHIP DIMENSIONS millimeters (inches)

0612

A

B

1.65

C

2.54

D

0.46

E

0.80

L

W

BW

0.41 0.10

BL

P

+0.25

0.89

3.20 0.20

1.60 0.20

0.18

0.80 0.10

(0.031 0.004)

-0.08

+0.010

-0.003

(0.035) (0.065) (0.100) (0.018) (0.031)

(0.126 0.008) (0.063 0.008) (0.016 0.004) (0.007

)

0508

A

B

C

D

E

L

W

BW

BL

P

+0.15

+0.25

-0.08

2.03 0.20

(0.080 0.008)

1.27 0.20

0.25

0.18

0.50 0.05

(0.020 0.002)

0.64

1.27

1.91

0.28

0.50

-0.10

+0.010

-0.003

(0.050 0.008) (0.010 ^+0.006

)

(0.007

)

(0.025) (0.050) (0.075) (0.011) (0.020)

-0.004

66

IDC Low Inductance Capacitors (SnPb)

0612/0508 IDC with Sn/Pb Termination

GENERAL DESCRIPTION

Inter-Digitated Capacitors (IDCs) are used for both semiconductor

package and board level decoupling. The equivalent series

inductance (ESL) of a single capacitor or an array of capacitors in

parallel determines the response time of a Power Delivery Network

(PDN). The lower the ESL of a PDN, the faster the response time.

A designer can use many standard MLCCs in parallel to reduce ESL

or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC

devices are available in versions with a maximum height of 0.95mm

or 0.55mm.

0612

0508

IDCs are typically used on packages of semiconductor products

+

–

+

–

with power levels of 15 watts or greater. Inter-Digitated Capacitors

are used on CPU, GPU, ASIC, and ASSP devices produced on

0.13µ, 90nm, 65nm, and 45nm processes. IDC devices are used

on both ceramic and organic package substrates. These low ESL

surface mount capacitors can be placed on the bottom side or the

top side of a package substrate. The low profile 0.55mm maximum

height IDCs can easily be used on the bottom side of BGA

packages or on the die side of packages under a heat spreader.

+

–

+

IDCs are used for board level decoupling of systems with speeds of

300MHz or greater. Low ESL IDCs free up valuable board space by

reducing the number of capacitors required versus standard

MLCCs. There are additional benefits to reducing the number of

capacitors beyond saving board space including higher reliability

from a reduction in the number of components and lower

placement costs based on the need for fewer capacitors.

The Inter-Digitated Capacitor (IDC) technology was developed by

AVX. This is the second family of Low Inductance MLCC products

created by AVX. IDCs are a cost effective alternative to AVX’s first

generation low ESL family for high-reliability applications known as

LICA (Low Inductance Chip Array).

TYPICAL IMPEDANCE

10

MLCC_1206

LICC_0612

1

0.1

IDC_0612

0.01

AVX IDC products are available with a lead termination for high

reliability military and aerospace applications that must avoid tin

whisker reliability issues.

0.001

1

10

100

1000

Frequency (MHz)

HOW TO ORDER

225

M

L

3

L

1

6

D

A

B

3

A

Capacitance Capacitance

Style

IDC

Case

Low

Inductance

Number

of

Terminals

1 = 8 Terminals

Dielectric

C = X7R

D = X5R

Z = X7S

Failure Termination Packaging

Thickness

Max. Thickness

mm (in.)

Voltage

4 = 4V

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

Code (In pF)

Tolerance

Rate

B = 5ꢀ min.

Lead

Available

Size

2 Sig. Digits + M = 20ꢀ

Number of

Zeros

A = N/A

1=7" Reel

3=13" Reel A=0.95 (0.037)

S=0.55 (0.022)

2 = 0508

3 = 0612

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

PERFORMANCE CHARACTERISTICS

Capacitance Tolerance

Operation

20ꢀ Preferred

Dielectric Strength

CTE (ppm/C)

No problems observed after 2.5 x RVDC

for 5 seconds at 50mA max current

X7R = -55ꢁC to +125ꢁC

X5R = -55ꢁC to +85ꢁC

X7S = -55ꢁC to +125ꢁC

15ꢀ (0VDC)

Temperature Range

12.0

Thermal Conductivity 4-5W/M K

Temperature Coefficient

Voltage Ratings

4, 6.3, 10, 16 VDC

Terminations

Available

Plated Nickel and 5ꢀ min. Lead

0.037" (0.95mm)

Dissipation Factor

4V, 6.3V = 6.5ꢀ max;

10V = 5.0ꢀ max;

16V = 3.5ꢀ max

Max. Thickness

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

µF min.,whichever is less

67

IDC Low Inductance Capacitors (SnPb)

0612/0508 IDC with Sn/Pb Termination

SIZE

Thin 0508

0508

Thin 0612

0612

mm

(in.)

2.03 0.20

3.20 0.20

Length

(0.080 0.008)

(0.126 0.008)

mm

(in.)

1.27 0.20

(0.050 0.008)

1.27 0.20

(0.050 0.008)

1.60 0.20

(0.063 0.008)

1.60 0.20

(0.063 0.008)

Width

Terminal

Pitch

mm

(in.)

0.50 0.05

(0.020 0.002)

0.50 0.05

(0.020 0.002)

0.80 0.10

(0.031 0.004)

0.80 0.10

(0.031 0.004)

mm

(in.)

0.55 MAX.

(0.022) MAX.

0.95 MAX.

(0.037) MAX.

0.55 MAX.

(0.022) MAX.

0.95 MAX.

(0.037) MAX.

Thickness

WVDC

4

6.3

10

16

25

4

6.3

10

16

25

4

6.3

10

16

4

6.3

10

16

Cap

(µF)

0.01

0.033

0.047

0.068

0.10

0.22

0.33

0.47

0.68

1.0

Consult factory for

additional requirements

= X7R

= X5R

= X7S

1.5

2.2

3.3

PHYSICAL DIMENSIONS AND PAD LAYOUT

L

P

E

T

D

BW

A

B

C

BL

W

PAD LAYOUT

DIMENSIONS

PHYSICAL CHIP DIMENSIONS millimeters (inches)

0612

A

B

1.65

C

2.54

D

0.46

E

0.80

L

W

BW

0.41 0.10

BL

P

+0.25

0.89

3.20 0.20

1.60 0.20

0.18

0.80 0.10

(0.031 0.004)

-0.08

+0.010

-0.003

(0.035) (0.065) (0.100) (0.018) (0.031)

(0.126 0.008) (0.063 0.008) (0.016 0.004) (0.007

)

0508

A

B

C

D

E

L

W

BW

0.254 0.10

BL

P

+0.25

-0.08

2.03 0.20

(0.080 0.008)

1.27 0.20

(0.050 0.008) (0.010 0.004) (0.007

0.18

0.50 0.05

(0.020 0.002)

0.64

1.27

1.91

0.28

0.50

+0.010

-0.003

)

(0.025) (0.050) (0.075) (0.011) (0.020)

68

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.

These new LGA products are the third low inductance family developed by AVX. The in-

novative LGA technology sets a new standard for low inductance MLCC performance.

Electronic Products awarded its 2006 Product of the Year Award to the LGA Decoupling

capacitor.

Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal

IDC low inductance MLCC with a number of advantages including:

• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs

• Opportunity to reduce PCB or substrate contribution to system ESL by using multi-

ple parallel vias in solder pads

• Advanced FCT manufacturing process used to create uniformly flat terminations on

the capacitor that resist “tombstoning”

• Better solder joint reliability

APPLICATIONS

Semiconductor Packages

• Microprocessors/CPUs

• Graphics Processors/GPUs

• Chipsets

• FPGAs

• ASICs

Board Level Device Decoupling

• Frequencies of 300 MHz or more

• ICs drawing 15W or more

• Low voltages

• High speed buses

0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC

1

0.1

0.01

0.001

1

10

100

1000

Frequency (MHz)

69

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

SIZE

LG12 (0204)

0.50 (0.020)

1.00 (0.039)

X7S (Z)

LG22 (0306)

0.76 (0.030)

1.60 (0.063)

LGC2 (0805)

2.06 (0.081)

1.32 (0.052)

Length

Width

mm (in.)

Temp. Char.

Working Voltage

X5R (D)

X6S (W)

X7R (C)

X5R (D)

6.3

(6)

X7S (Z)

X6S (W)

X7R (C)

X5R (D)

X7S (Z)

X6S (W)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

4

(4)

10

(Z)

6.3

(6)

4

(4)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

6.3

(6)

4

(4)

(6)

Cap (µF)

0.010 (103)

0.022 (223)

0.047 (473)

0.100 (104)

0.220 (224)

0.330 (334)

0.470 (474)

1.000 (105)

2.200 (225)

Please

contact AVX

for values

= X7R

= X5R

= X7S

= X6S

HOW TO ORDER

LG

1

2

6

Z

104

M

A

T

2

S

1

Style Case Number of Working Temperature Coded

Cap

Termination Termination Packaging

Thickness

Number of

Size

Terminals Voltage Characteristic Cap Tolerance

Style

100ꢀ Sn*

Tape & Reel S = 0.55mm Capacitors

1 = 0204

2 = 0306

2

4 = 4V

6 = 6.3V

Z = 10V

C = X7R

D = X5R

Z = X7S

W = X6S

M = 20ꢀ A = “U” Land

2 = 7" Reel

max

*Contact factory for

other termination

finishes

4 = 13" Reel

C

= 0805

Reverse

Geometry LGA

LG12, LG22

Standard

Geometry LGA

LGC2

BL

L

BL

L

T

BL

BW

W

BL

BW

W

L

PART DIMENSIONS

mm (inches)

Series

L

W

T

BW

BL

0.5 0.05

(0.020 0.002)

1.00 0.10

(0.039 0.004)

0.50 0.05

(0.020 0.002)

0.8 0.10

(0.031 0.004)

0.13 0.08

(0.005 0.003)

LG12 (0204)

0.76 0.10

(0.030 0.004)

1.60 0.10

(0.063 0.004)

0.50 0.05

(0.020 0.002)

1.50 0.10

(0.059 0.004)

0.28 0.08

(0.011 0.003)

LG22 (0306)

LGC2 (0805)

2.06 0.10

(0.081 0.004)

1.32 0.10

(0.052 0.004)

0.50 0.05

(0.020 0.002)

1.14 0.10

(0.045 0.004)

0.90 0.08

(0.035 0.003)

RECOMMENDED SOLDER PAD DIMENSIONS

mm (inches)

PL

Series

PL

PW1

G

LG12 (0204)

LG22 (0306)

LGC2 (0805)

0.50 (0.020)

0.65 (0.026)

1.25 (0.049)

1.00 (0.039)

1.50 (0.059)

1.40 (0.055)

0.20 (0.008)

G

PW1

70

Low Inductance Capacitors

LICA^®(Low Inductance Decoupling Capacitor Arrays)

LICA^®arrays utilize up to four separate capacitor sections in one

ceramic body (see Configurations and Capacitance Options). These

designs exhibit a number of technical advancements:

Low Inductance features–

Low resistance platinum electrodes in a low aspect ratio pattern

Double electrode pickup and perpendicular current paths

C4 “flip-chip” technology for minimal interconnect inductance

HOW TO ORDER

4

A

LICA

3

T

102

M

3

F

C

# of

Inspection

Code

Face

A = Bar

B = No Bar

Style

&

Size

Voltage Dielectric

5V = 9 D = X5R

10V = Z T = T55T

25V = 3 S = High K 103 = 10 nF

T55T 104 = 100 nF

Cap/Section Capacitance Height

(EIA Code) Tolerance Code

102 = 1000 pF M = 20ꢀ 6 = 0.500mm

Termination

Reel Packaging

M = 7" Reel

R = 13" Reel

6 = 2"x2" Waffle Pack

8 = 2"x2" Black Waffle

Pack

7 = 2"x2" Waffle Pack

w/ termination

facing up

Caps/Part

F = C4 Solder

1 = one A = Standard

2 = two B = COTS+

4 = four

Balls- 97Pb/3Sn

P = GMV

3 = 0.650mm H = C4 Solder Balls

X = MIL-PRF-123 C = Dot, S55S

Dielectrics

1 = 0.875mm

Low ESR

5 = 1.100mm G = Lead Free SAC

7 = 1.600mm R = Cr-Cu-Au

N = Cr-Ni-Au

D = Triangle

V = Eutectic Lead-

Tin Bump-

A = 2"x2" Black Waffle

Pack

37ꢀPb/63ꢀSn

X = None

w/ termination

facing up

C = 4"x4" Waffle Pack

w/ clear lid

TABLE 1

NOTE: Contact factory for

availability of Termination and

Tolerance Options for Specific

Part Numbers.

Typical Parameters

Capacitance, 25°C

Capacitance, 55°C

Capacitance, 85°C

Dissipation Factor 25°

ESR (Nominal)

DC Resistance

IR (Minimum @25°) (Design Dependent)

Dielectric Breakdown, Min

T55T/S55S

Units

Nanofarads

Percent

Milliohms

Ohms

Megaohms

Volts

ppm/°C 25-100°

Pico-Henries

Co

1.45 x Co

0.7 x Co

15

20

0.2

300

500

8.5

30

Thermal Coefficient of Expansion

Inductance: (Design Dependent) (Nominal)

Frequency of Operation

DC to 5 Gigahertz

-55° to 125°C

TERMINATION OPTIONS

Ambient Temp Range

SOLDER BALLS

SOLDER BALL AND PAD DIMENSIONS

TERMINATION OPTION F, H, G OR V

0.8 .03 (2 pics)

0.6 .100mm

“Centrality”*

}

0.925 0.03mm

L = .06mm

0.925 0.03mm

Vertical and

Horizontal

Pitch=0.4 .02mm

Code Face

to Denote

Orientation

(Optional)

C4 Ball diameter:

.164 .03mm

TERMINATION OPTION R OR N

*NOTE: The C4 pattern

will be within

0.1mm of the

center of the

"H " = (H +.096 .02mm typ)

t

b

"H " .06

b

LICA body, in

both axes.

"W" = .06mm

Pin A1 is the lower left hand ball.

Code

(Body Height)

Width

(W)

Length

(L)

Height

Body (H_b)

1

3

5

6

7

1.600mm

1.850mm

0.875mm

0.650mm

1.100mm

0.500mm

1.600mm

71

Low Inductance Capacitors

LICA^®(Low Inductance Decoupling Capacitor Arrays)

TEMPERATURE VS CAPACITANCE CHANGE

TYPICAL S21 FOR LICA AT SINGLE VIA

Maximum

+45%

0

-14

-28

-42

-56

-70

LICA T55T/S55S

CERAMIC

0%

Maximum

-30%

3

30

300

3000

25°C

50°C

60°C

85°C

Freq (MHz)

LICA COMMON PART NUMBER LIST

CONFIGURATION

Schematic

Code Face

Capacitors per

Package

Part Number

Voltage Thickness (mm)

D

B

LICA3T193M3FC4AA

LICA3T153P3FC4AA

LICA3T134M1FC1AA

LICA3T104P1FC1AA

LICA3T333M1FC4AA

LICA3T263P3FC4AA

LICA3T244M5FC1AA

LICA3T194P5FC1AA

LICA3T394M7FC1AB

LICA3T314P7FC1AB

Extended Range

25

0.650

0.875

0.650

1.100

1.600

4

1

4

1

D

C

B

A

CAP

C

A

Schematic

Code Face

D1 C1 B1 A1

D2 C2 B2 A2

B1

B2

CAP 2

A2

D1

C1

D2

CAP 1

A1

C2

LICAZT623M3FC4AB

LICA3T104M3FC1A

LICA3T803P3FC1A

LICA3T423M3FC2A

LICA3T333P3FC2A

LICA3S253M3FC4A

LICAZD753M3FC4AD

LICAZD504M3FC1AB

LICAZD604M7FC1AB

LICA3D193M3FC4AB

10

25

10

25

0.650

1.600

0.650

4

1

2

4

1

4

Schematic

Code Face

B1

B2

D1

D2

D1 C1 B1 A1

D2 C2 B2 A2

D3 C3 B3 A3

D4 C4 B4 A4

CAP 1

CAP 2

A1

B3

A2

B4

C1

D3

C2

D4

CAP 3

A3

CAP 4

A4

C3

C4

WAFFLE PACK OPTIONS FOR LICA^®

LICA^®PACKAGING SCHEME “M” AND “R”

8mm conductive plastic tape on reel:

“M”=7" reel max. qty. 3,000, “R”=13" reel max. qty. 8,000

FLUOROWARE®

Code Face

to Denote

Orientation

Code Face

to Denote

Orientation

®

Wells for LICA part, C4 side down

76 pieces/foot

1.75mm x 2.01mm x 1.27mm deep

on 4mm centers

0.64mm Push Holes

H20-080

Option "6"

Option "C"

Code Face

to Denote

Orientation

(Typical)

100 pcs.

per 2" x 2"

package

400 pcs. per

1.75mm

4" x 4" package

Note: Standard configuration is

Termination side down

Sprocket Holes: 1.55mm, 4mm pitch

72

High Voltage MLC Chips

For 600V to 5000V Application

High value, low leakage and small size are difficult parameters to obtain

in capacitors for high voltage systems. AVX special high voltage MLC

chip capacitors meet these performance characteristics and are

designed for applications such as snubbers in high frequency power

converters, resonators in SMPS, and high voltage coupling/dc blocking.

These high voltage chip designs exhibit low ESRs at high frequencies.

Larger physical sizes than normally encountered chips are used to make

high voltage MLC chip products. Special precautions must be taken in

applying these chips in surface mount assemblies. The temperature

gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak

temperature reached by the ceramic bodies through the soldering

process. Chip sizes 1210 and larger should be reflow soldered only.

Capacitors may require protective surface coating to prevent external

arcing.

NEW 630V RANGE

HOW TO ORDER

1808

A

271

K

A

1

A

AVX

Style

0805

1206

1210

1808

1812

1825

2220

2225

3640

Voltage

Temperature Capacitance Code Capacitance

Test Level

A = Standard 1 = Pd/Ag

T = Plated

Termination*

Packaging

Special

Code

600V/630V = C Coefficient

(2 significant digits

+ no. of zeros)

Examples:

Tolerance

C0G:J = 5ꢀ

K = 10ꢀ

1 = 7" Reel

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

C0G = A

X7R = C

3 = 13" Reel A = Standard

9 = Bulk

Ni and Sn

(RoHS Compliant)

10 pF = 100

M = 20ꢀ

100 pF = 101 X7R:K = 10ꢀ

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF =105

M = 20ꢀ

Z = +80ꢀ,

-20ꢀ

*Note: Terminations with 5ꢀ minimum lead (Pb) is available, see pages 75 and 76 for LD style.

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

W

L

T

t

DIMENSIONS

millimeters (inches)

SIZE

0805

1206

1210*

1808*

1812*

1825*

2220*

2225*

3640*

(L) Length

2.01 0.20

3.20 0.20

4.57 0.25

4.50 0.30

5.70 0.40

5.72 0.25

9.14 0.25

(0.079 0.008) (0.126 0.008) (0.126 0.008) (0.180 0.010) (0.177 0.012) (0.177 0.012) (0.224 0.016) (0.225 0.010) (0.360 0.010)

1.25 0.20 1.60 0.20 2.50 0.20 2.03 0.25 3.20 0.20 6.40 0.30 5.00 0.40 6.35 0.25 10.2 0.25

(0.049 0.008) (0.063 0.008) (0.098 0.008) (0.080 0.010) (0.126 0.008) (0.252 0.012) (0.197 0.016) (0.250 0.010) (0.400 0.010)

(W) Width

(T) Thickness

Max.

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.03

(0.080)

2.54

(0.100)

2.54

(0.100)

3.30

(0.130)

2.54

(0.100)

2.54

(0.100)

(t) terminal min.

0.50 0.25

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.76 (0.030)

1.52 (0.060)

max. (0.020 0.010) 0.75 (0.030)

*Reflow Soldering Only

73

High Voltage MLC Chips

For 600V to 5000V Applications

C0G Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.047 µF

(25ꢁC, 1.0 0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)

Capacitance Tolerances

5ꢀ, 10ꢀ, 20ꢀ

Dissipation Factor

0.1ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

-55ꢁC to +125ꢁC

0

30 ppm/ꢁC (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

HIGH VOLTAGE C0G CAPACITANCE VALUES

VOLTAGE

min.

0805

10pF

1206

1210

1808

1812

1825

2220

2225

3640

10 pF

1200 pF

10 pF

560 pF

10 pF

270 pF

10 pF

120 pF

—

100 pF

2700 pF

10 pF

1500 pF

10 pF

680 pF

10 pF

270 pF

—

100 pF

3300 pF

100 pF

2200 pF

10 pF

820 pF

10 pF

330 pF

10 pF

180 pF

10 pF

120 pF

10 pF

47 pF

—

100 pF

5600 pF

100 pF

3300 pF

10 pF

1000 pF

0.012 µF

100 pF

8200 pF

100 pF

4700 pF

100 pF

1800 pF

10 pF

1000 pF

0.012 µF

1000 pF

0.010 µF

100 pF

4700 pF

100 pF

2200 pF

100 pF

1500 pF

10 pF

1000 pF

0.018 µF

1000 pF

0.010 µF

100 pF

5600 pF

100 pF

2700 pF

100 pF

1800 pF

10 pF

1000 pF

0.047 µF

1000 pF

0.022 µF

100 pF

600/630

1000

1500

2000

2500

3000

4000

5000

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

330pF

10pF

180pF

—

1800 pF

10 pF

0.010 µF

100 pF

—

1000 pF

10 pF

6800 pF

100 pF

—

470 pF

10 pF

1200 pF

10 pF

3900 pF

100 pF

—

330 pF

10 pF

820 pF

10 pF

1000 pF

10 pF

1200 pF

10 pF

2700 pF

100 pF

—

150 pF

—

330 pF

—

470 pF

10 pF

560 pF

10 pF

1200 pF

10 pF

—

220 pF

270 pF

820 pF

X7R Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.56 µF (25ꢁC, 1.0 0.2 Vrms at 1kHz)

10ꢀ; 20ꢀ; +80ꢀ, -20ꢀ

Capacitance Tolerances

Dissipation Factor

2.5ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)

-55ꢁC to +125ꢁC

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

15ꢀ (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES

VOLTAGE

0805

1206

1210

1808

1812

1825

2220

2225

3640

min.

100pF

6800pF

100pF

1500pF

—

1000 pF

0.022 µF

100 pF

1000 pF

0.056 µF

1000 pF

0.015 µF

100 pF

4700 pF

6800 pF

100 pF

3000 pF

3900 pF

—

1000 pF

0.056 µF

1000 pF

0.018 µF

100 pF

1000 pF

0.100 µF

1000 pF

0.027 µF

100 pF

0.012 µF

0.015 µF

100 pF

4700 pF

8200 pF

10 pF

0.010 µF

0.180 µF

1000 pF

0.100 µF

1000 pF

0.033 µF

0.056 µF

100 pF

0.010 µF

0.027 µF

100 pF

6800 pF

0.015 µF

100 pF

4700 pF

0.012 µF

—

0.010 µF

0.220 µF

1000 pF

0.100 µF

1000 pF

0.039 µF

0.056 µF

1000 pF

0.010 µF

0.027 µF

100 pF

8200 pF

0.018 µF

100 pF

4700 µF

0.012 µF

—

0.010 µF

0.220 µF

1000 pF

0.100 µF

1000 pF

0.047 µF

0.068 µF

1000 pF

0.022 µF

0.033 µF

100 pF

0.010 µF

0.022 µF

100 pF

6800 pF

0.015 µF

—

0.010 µF

0.560 µF

0.010 µF

0.220 µF

1000 pF

0.100 µF

600/630

max.

min.

max.

min.

max.

1000

6800 pF

100 pF

1500

—

2700 pF

6800 pF

Development

min.

—

10 pF

1500 pF

100 pF

2700 pF

3900 pF

10 pF

1800 pF

2200 pF

10 pF

1500 pF

1800 pF

—

1000 pF

0.027 µF

2000

max.

Development

min.

—

1000 pF

0.022 µF

2500

max.

—

3300 pF

5600 pF

10 pF

Development

min.

—

1000 pF

0.018 µF

3000

max.

2200 pF

4700 pF

—

Development

min.

—

100 pF

6800 pF

100 pF

4000

max.

—

min.

max.

—

5000

—

3300 pF

74

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Application

AVX Corporation will support those customers for commercial and

military Multilayer Ceramic Capacitors with a termination consisting of

5ꢀ minimum lead. This termination is indicated by the use of a “B” in

the 12th position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our customers. AVX

has provided in the following pages, a full range of values that we are

offering in this “B” termination.

Larger physical sizes than normally encountered chips are used to make

high voltage MLC chip product. Special precautions must be taken in

applying these chips in surface mount assemblies. The temperature

gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak

temperature reached by the ceramic bodies through the soldering

process. Chip sizes 1210 and larger should be reflow soldered only.

Capacitors may require protective surface coating to prevent external

arcing.

NEW 630V RANGE

HOW TO ORDER

LD08

A

271

K

A

B

1

A

AVX

Voltage

600V/630V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

Temperature Capacitance Code

Capacitance

Tolerance

Test

Level

A = Standard

Termination

B = 5ꢀ Min Pb 1 = 7" Reel

3 = 13" Reel

Packaging Special Code

Style

Coefficient

C0G = A

X7R = C

(2 significant digits

+ no. of zeros)

Examples:

A = Standard

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD08 - 1808

LD12 - 1812

LD13 - 1825

LD20 - 2220

LD14 - 2225

LD40 - 3640

C0G: J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

X7R: K = 10ꢀ

M = 20ꢀ

9 = Bulk

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF =105

Z = +80ꢀ, -20ꢀ

5000V = K

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

W

L

T

t

DIMENSIONS

millimeters (inches)

SIZE

LD05 (0805)

LD06 (1206)

LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD25* (2225) LD40* (3640)

(L) Length

2.01 0.20

3.20 0.20

4.57 0.25

4.50 0.30

5.70 0.40

5.72 0.25

9.14 0.25

(0.079 0.008) (0.126 0.008) (0.126 0.008) (0.180 0.010) (0.177 0.012) (0.177 0.012) (0.224 0.016) (0.225 0.010) (0.360 0.010)

1.25 0.20 1.60 0.20 2.50 0.20 2.03 0.25 3.20 0.20 6.40 0.30 5.00 0.40 6.35 0.25 10.2 0.25

(0.049 0.008) (0.063 0.008) (0.098 0.008) (0.080 0.010) (0.126 0.008) (0.252 0.012) (0.197 0.016) (0.250 0.010) (0.400 0.010)

(W) Width

(T) Thickness

Max.

1.30

(0.051)

1.52

(0.060)

1.70

(0.067)

2.03

(0.080)

2.54

(0.100)

2.54

(0.100)

3.30

(0.130)

2.54

(0.100)

2.54

(0.100)

(t) terminal min.

0.50 0.25

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.76 (0.030)

1.52 (0.060)

max. (0.020 0.010) 0.75 (0.030)

* Reflow soldering only.

75

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Application

C0G Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.047 µF

(25ꢁC, 1.0 0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)

Capacitance Tolerances

5ꢀ, 10ꢀ, 20ꢀ

Dissipation Factor

0.1ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)

-55ꢁC to +125ꢁC

0 30 ppm/ꢁC (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

HIGH VOLTAGE C0G CAPACITANCE VALUES

VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

min.

max.

10pF

330pF

10pF

180pF

—

10 pF

1200 pF

10 pF

560 pF

10 pF

270 pF

10 pF

120 pF

—

100 pF

2700 pF

10 pF

1500 pF

10 pF

680 pF

10 pF

270 pF

—

100 pF

3300 pF

100 pF

2200 pF

10 pF

820 pF

10 pF

330 pF

10 pF

180 pF

10 pF

120 pF

10 pF

47 pF

—

100 pF

5600 pF

100 pF

3300 pF

10 pF

1000 pF

0.012 µF

100 pF

8200 pF

100 pF

4700 pF

100 pF

1800 pF

10 pF

1000 pF

0.012 µF

1000 pF

0.010 µF

100 pF

4700 pF

100 pF

2200 pF

100 pF

1500 pF

10 pF

1000 pF

0.018 µF

1000 pF

0.010 µF

100 pF

5600 pF

100 pF

2700 pF

100 pF

1800 pF

10 pF

1000 pF

0.047 µF

1000 pF

0.022 µF

100 pF

600/630

1000

1500

2000

2500

3000

4000

5000

—

1800 pF

10 pF

0.010 µF

100 pF

—

1000 pF

10 pF

6800 pF

100 pF

—

470 pF

10 pF

1200 pF

10 pF

3900 pF

100 pF

—

330 pF

10 pF

820 pF

10 pF

1000 pF

10 pF

1200 pF

10 pF

2700 pF

100 pF

—

150 pF

—

330 pF

—

470 pF

10 pF

220 pF

560 pF

10 pF

270 pF

1200 pF

10 pF

—

820 pF

X7R Dielectric

Performance Characteristics

Capacitance Range

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

10 pF to 0.56 µF (25ꢁC, 1.0 0.2 Vrms at 1kHz)

10ꢀ; 20ꢀ; +80ꢀ, -20ꢀ

2.5ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)

-55ꢁC to +125ꢁC

15ꢀ (0 VDC)

600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)

Insulation Resistance (+25ꢁC, at 500 VDC)

Insulation Resistance (+125ꢁC, at 500 VDC)

Dielectric Strength

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current

HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES

VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)

min.

max.

min.

100pF

6800pF

100pF

1500pF

—

1000 pF

0.022 µF

100 pF

1000 pF

0.056 µF

1000 pF

0.015 µF

100 pF

4700 pF

6800 pF

100 pF

3300 pF

3900 pF

—

1000 pF

0.056 µF

1000 pF

0.018 µF

100 pF

1000 pF

0.100 µF

1000 pF

0.027 µF

100 pF

0.012 µF

0.015 µF

100 pF

4700 pF

8200 pF

10 pF

0.010 µF

0.180 µF

1000 pF

0.100 µF

1000 pF

0.033 µF

0.056 µF

100 pF

0.010 µF

0.027 µF

100 pF

6800 pF

0.015 µF

100 pF

4700 pF

0.012 µF

—

0.010 µF

0.220 µF

1000 pF

0.100 µF

1000 pF

0.039 µF

0.056 µF

1000 pF

0.010 µF

0.027 µF

100 pF

8200 pF

0.018 µF

100 pF

4700 µF

0.012 µF

—

0.010 µF

0.220 µF

1000 pF

0.100 µF

1000 pF

0.047 µF

0.068 µF

1000 pF

0.022 µF

0.033 µF

100 pF

0.010 µF

0.022 µF

100 pF

6800 pF

0.015 µF

—

0.010 µF

0.560 µF

0.010 µF

0.220 µF

1000 pF

0.100 µF

600/630

1000

max.

min.

6800 pF

100 pF

1500

max.

—

2700 pF

6800 pF

Development

min.

—

10 pF

1500 pF

100 pF

2700 pF

3900 pF

10 pF

1800 pF

2200 pF

10 pF

1500 pF

1800 pF

—

1000 pF

0.027 µF

2000

max.

Development

min.

—

1000 pF

0.022 µF

2500

max.

—

3300 pF

5600 pF

10 pF

Development

min.

—

1000 pF

0.018 µF

3000

max.

2200 pF

4700 pF

—

Development

min.

—

100 pF

6800 pF

100 pF

4000

max.

—

min.

—

5000

max.

—

3300 pF

76

MIL-PRF-55681/Chips

Part Number Example

CDR01 thru CDR06

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

CDR01 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

NOTE: Contact factory for availability of Termination and Tolerance Options for

Specific Part Numbers.

MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,

Termination Finish:

CDR06

M = Palladium Silver

N = Silver Nickel Gold

S = Solder-coated

U = Base Metallization/Barrier

Metal/Solder Coated*

W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

Voltage Temperature Limits:

BP = 0 30 ppm/ꢁC without voltage; 0 30 ppm/ꢁC with

rated voltage from -55ꢁC to +125ꢁC

BX = 15ꢀ without voltage; +15 –25ꢀ with rated voltage

from -55ꢁC to +125ꢁC

*Solder shall have a melting point of 200ꢁC or less.

Failure Rate Level: M = 1.0ꢀ, P = .1ꢀ, R = .01ꢀ,

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

S = .001ꢀ

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Rated Voltage: A = 50V, B = 100V

Capacitance Tolerance: J 5ꢀ, K 10ꢀ, M 20ꢀ

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*

Thickness (T)

D

Termination Band (t)

Per

AVX

Length (L)

Width (W)

MIL-PRF-55681 Style

Max.

Min.

.020

Max.

—

Min.

.030

—

Max.

—

Min.

.010

CDR01

CDR02

CDR03

CDR04

0805 .080 .015 .050 .015 .055

1805 .180 .015 .050 .015 .055

1808 .180 .015 .080 .018 .080

1812 .180 .015 .125 .015 .080

—

.030

—

+.020

-.015

+.020

-.015

CDR05

1825 .180

.250

.080

.020

—

.030

.010

CDR06

2225 .225 .020 .250 .020 .080

*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog

77

MIL-PRF-55681/Chips

Military Part Number Identification

CDR01 thru CDR06

CDR01 thru CDR06 to MIL-PRF-55681

Military

Type

Designation

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF

tolerance

in pF

tolerance

AVX Style 0805/CDR01

AVX Style 1808/CDR03

CDR01BP100B---

CDR01BP120B---

CDR01BP150B---

CDR01BP180B---

CDR01BP220B---

10

12

15

18

22

J,K

J

J,K

J

BP

100

CDR03BP331B---

CDR03BP391B---

CDR03BP471B---

CDR03BP561B---

CDR03BP681B---

330

390

470

560

680

J,K

J

J,K

J

BP

100

J,K

CDR01BP270B---

CDR01BP330B---

CDR01BP390B---

CDR01BP470B---

CDR01BP560B---

27

33

39

47

56

J

J,K

J

J,K

J

BP

100

CDR03BP821B--

CDR03BP102B---

CDR03BX123B--

CDR03BX153B---

CDR03BX183B---

820

1000

12,000

15,000

18,000

J

J,K

K

K,M

K

BP

BX

100

CDR01BP680B---

CDR01BP820B---

CDR01BP101B---

CDR01B--121B---

CDR01B--151B---

68

82

100

120

150

J,K

J

J,K

BP

BP,BX

100

CDR03BX223B---

CDR03BX273B---

CDR03BX333B---

CDR03BX393A---

CDR03BX473A---

22,000

27,000

33,000

39,000

47,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR01B--181B---

CDR01BX221B---

CDR01BX271B---

CDR01BX331B---

CDR01BX391B---

180

220

270

330

390

J,K

K,M

K

K,M

K

BP,BX

BX

100

CDR03BX563A---

CDR03BX683A---

56,000

68,000

K

K,M

BX

50

AVX Style 1812/CDR04

CDR04BP122B---

CDR04BP152B---

CDR04BP182B---

CDR04BP222B---

CDR04BP272B---

1200

1500

1800

2200

2700

J

J,K

J

J,K

J

BP

100

CDR01BX471B---

CDR01BX561B---

CDR01BX681B---

CDR01BX821B---

CDR01BX102B---

470

560

680

820

1000

K,M

K

K,M

K

BX

100

K,M

CDR04BP332B---

CDR04BX393B---

CDR04BX473B---

CDR04BX563B---

CDR04BX823A---

3300

J,K

K

K,M

K

BP

BX

100

50

CDR01BX122B---

CDR01BX152B---

CDR01BX182B---

CDR01BX222B---

CDR01BX272B---

1200

1500

1800

2200

2700

K

K,M

K

K,M

K

BX

100

39,000

47,000

56,000

82,000

K

CDR04BX104A---

CDR04BX124A---

CDR04BX154A---

CDR04BX184A---

100,000

120,000

150,000

180,000

K,M

K

K,M

K

BX

50

CDR01BX332B---

CDR01BX392A---

CDR01BX472A---

3300

3900

4700

K,M

K

K,M

BX

100

50

AVX Style 1805/CDR02

AVX Style 1825/CDR05

CDR02BP221B---

CDR02BP271B---

CDR02BX392B---

CDR02BX472B---

CDR02BX562B---

220

270

3900

4700

5600

J,K

J

K

K,M

K

BP

BX

100

CDR05BP392B---

CDR05BP472B---

CDR05BP562B---

CDR05BX683B---

CDR05BX823B---

3900

4700

5600

68,000

82,000

J,K

K,M

K

BP

BX

100

CDR02BX682B---

CDR02BX822B---

CDR02BX103B---

CDR02BX123A---

CDR02BX153A---

6800

8200

10,000

12,000

15,000

K,M

K

K,M

K

BX

100

50

CDR05BX104B---

CDR05BX124B---

CDR05BX154B---

CDR05BX224A---

CDR05BX274A---

100,000

120,000

150,000

220,000

270,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR02BX183A---

CDR02BX223A---

18,000

22,000

K

K,M

BX

50

CDR05BX334A---

330,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

AVX Style 2225/CDR06

CDR06BP682B---

CDR06BP822B---

CDR06BP103B---

CDR06BX394A---

CDR06BX474A---

6800

8200

10,000

390,000

470,000

J,K

K

BP

BX

100

50

K,M

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

78

MIL-PRF-55681/Chips

Part Number Example

CDR31 thru CDR35

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

(example) CDR31 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

NOTE: Contact factory for aꢂailability of Termination and Tolerance Options for

Specific Part Numbers.

MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35

Termination Finish:

M = Palladium Silꢂer

N = Silꢂer Nickel Gold

S = Solder-coated

Y = 100ꢄ Tin

U = Base MetallizationꢀBarrier

MetalꢀSolder Coated*

W = Base MetallizationꢀBarrier

MetalꢀTinned (Tin or Tinꢀ

Lead Alloy)

Voltage Temperature Limits:

BP = 0 30 ppmꢀ/C ꢁithout ꢂoltageꢃ 0 30 ppmꢀ/C ꢁith

rated ꢂoltage from -55/C to +125/C

BX = 15ꢄ ꢁithout ꢂoltageꢃ +15 ꢅ25ꢄ ꢁith rated ꢂoltage

from -55/C to +125/C

*Solder shall haꢂe a melting point of 200/C or less.

Capacitance: Tꢁo digit figures folloꢁed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Failure Rate Level: M = 1.0ꢄ, P = .1ꢄ, R = .01ꢄ,

S = .001ꢄ

Rated Voltage: A = 50V, B = 100V

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is aꢂailable upon request.

Capacitance Tolerance: B .10 pF, C .25 pF, D .5

pF, F 1ꢄ, ꢆ 5ꢄ, ꢇ 10ꢄ,

M

20ꢄ

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35

Thickness (T)

D

Termination Band (t)

Per MIL-PRF-55681 AVX

Length (L) Width (W)

(Metric Sizes)

Style

(mm)

Max. (mm)

Min. (mm) Max. (mm) Min. (mm)

CDR31

CDR32

CDR33

CDR34

CDR35

0805

1206

1210

1812

1825

2.00

3.20

4.50

1.25

1.60

2.50

3.20

6.40

1.3

1.5

.50

—

.70

.30

79

MIL-PRF-55681/Chips

Military Part Number Identification CDR31

CDR31 to MIL-PRF-55681/7

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 0805/CDR31 (BP)

AVX Style 0805/CDR31 (BP) cont’d

CDR31BP1R0B---

CDR31BP1R1B---

CDR31BP1R2B---

CDR31BP1R3B---

CDR31BP1R5B---

1.0

1.1

1.2

1.3

1.5

B,C

BP

100

CDR31BP101B---

CDR31BP111B---

CDR31BP121B---

CDR31BP131B---

CDR31BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR31BP1R6B---

CDR31BP1R8B---

CDR31BP2R0B---

CDR31BP2R2B---

CDR31BP2R4B---

1.6

1.8

2.0

2.2

2.4

B,C

BP

100

CDR31BP161B---

CDR31BP181B---

CDR31BP201B---

CDR31BP221B---

CDR31BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR31BP2R7B---

CDR31BP3R0B---

CDR31BP3R3B---

CDR31BP3R6B---

CDR31BP3R9B---

2.7

3.0

3.3

3.6

3.9

B,C,D

BP

100

CDR31BP271B---

CDR31BP301B---

CDR31BP331B---

CDR31BP361B---

CDR31BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR31BP4R3B---

CDR31BP4R7B---

CDR31BP5R1B---

CDR31BP5R6B---

CDR31BP6R2B---

4.3

4.7

5.1

5.6

6.2

B,C,D

BP

100

CDR31BP431B---

CDR31BP471B---

CDR31BP511A---

CDR31BP561A---

CDR31BP621A---

430

470

510

560

620

F,J,K

BP

100

50

CDR31BP6R8B---

CDR31BP7R5B---

CDR31BP8R2B---

CDR31BP9R1B---

CDR31BP100B---

6.8

7.5

8.2

9.1

10

B,C,D

F,J,K

BP

100

CDR31BP681A---

680

F,J,K

BP

50

AVX Style 0805/CDR31 (BX)

CDR31BX471B---

CDR31BX561B---

CDR31BX681B---

CDR31BX821B---

CDR31BX102B---

470

560

680

820

1,000

K,M

BX

100

CDR31BP110B---

CDR31BP120B---

CDR31BP130B---

CDR31BP150B---

CDR31BP160B---

11

12

13

15

16

F,J,K

BP

100

CDR31BX122B---

CDR31BX152B---

CDR31BX182B---

CDR31BX222B---

CDR31BX272B---

1,200

1,500

1,800

2,200

2,700

K,M

BX

100

CDR31BP180B---

CDR31BP200B---

CDR31BP220B---

CDR31BP240B---

CDR31BP270B---

18

20

22

24

27

F,J,K

BP

100

CDR31BX332B---

CDR31BX392B---

CDR31BX472B---

CDR31BX562A---

CDR31BX682A---

3,300

3,900

4,700

5,600

6,800

K,M

BX

100

50

CDR31BP300B---

CDR31BP330B---

CDR31BP360B---

CDR31BP390B---

CDR31BP430B---

30

33

36

39

43

F,J,K

BP

100

50

CDR31BX822A---

CDR31BX103A---

CDR31BX123A---

CDR31BX153A---

CDR31BX183A---

8,200

10,000

12,000

15,000

18,000

K,M

BX

50

CDR31BP470B---

CDR31BP510B---

CDR31BP560B---

CDR31BP620B---

CDR31BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR31BP750B---

CDR31BP820B---

CDR31BP910B---

75

82

91

F,J,K

BP

100

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

80

MIL-PRF-55681/Chips

Military Part Number Identification CDR32

CDR32 to MIL-PRF-55681/8

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1206/CDR32 (BP)

AVX Style 1206/CDR32 (BP) cont’d

CDR32BP1R0B---

CDR32BP1R1B---

CDR32BP1R2B---

CDR32BP1R3B---

CDR32BP1R5B---

1.0

1.1

1.2

1.3

1.5

B,C

BP

100

CDR32BP101B---

CDR32BP111B---

CDR32BP121B---

CDR32BP131B---

CDR32BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR32BP1R6B---

CDR32BP1R8B---

CDR32BP2R0B---

CDR32BP2R2B---

CDR32BP2R4B---

1.6

1.8

2.0

2.2

2.4

B,C

BP

100

CDR32BP161B---

CDR32BP181B---

CDR32BP201B---

CDR32BP221B---

CDR32BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR32BP2R7B---

CDR32BP3R0B---

CDR32BP3R3B---

CDR32BP3R6B---

CDR32BP3R9B---

2.7

3.0

3.3

3.6

3.9

B,C,D

BP

100

CDR32BP271B---

CDR32BP301B---

CDR32BP331B---

CDR32BP361B---

CDR32BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR32BP4R3B---

CDR32BP4R7B---

CDR32BP5R1B---

CDR32BP5R6B---

CDR32BP6R2B---

4.3

4.7

5.1

5.6

6.2

B,C,D

BP

100

CDR32BP431B---

CDR32BP471B---

CDR32BP511B---

CDR32BP561B---

CDR32BP621B---

430

470

510

560

620

F,J,K

BP

100

CDR32BP6R8B---

CDR32BP7R5B---

CDR32BP8R2B---

CDR32BP9R1B---

CDR32BP100B---

6.8

7.5

8.2

9.1

10

B,C,D

F,J,K

BP

100

CDR32BP681B---

CDR32BP751B---

CDR32BP821B---

CDR32BP911B---

CDR32BP102B---

680

750

820

910

1,000

F,J,K

BP

100

CDR32BP110B---

CDR32BP120B---

CDR32BP130B---

CDR32BP150B---

CDR32BP160B---

11

12

13

15

16

F,J,K

BP

100

CDR32BP112A---

CDR32BP122A---

CDR32BP132A---

CDR32BP152A---

CDR32BP162A---

1,100

1,200

1,300

1,500

1,600

F,J,K

BP

50

CDR32BP180B---

CDR32BP200B---

CDR32BP220B---

CDR32BP240B---

CDR32BP270B---

18

20

22

24

27

F,J,K

BP

100

CDR32BP182A---

CDR32BP202A---

CDR32BP222A---

1,800

2,000

2,200

F,J,K

BP

50

AVX Style 1206/CDR32 (BX)

CDR32BP300B---

CDR32BP330B---

CDR32BP360B---

CDR32BP390B---

CDR32BP430B---

30

33

36

39

43

F,J,K

BP

100

CDR32BX472B---

CDR32BX562B---

CDR32BX682B---

CDR32BX822B---

CDR32BX103B---

4,700

5,600

6,800

8,200

10,000

K,M

BX

100

CDR32BP470B---

CDR32BP510B---

CDR32BP560B---

CDR32BP620B---

CDR32BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR32BX123B---

CDR32BX153B---

CDR32BX183A---

CDR32BX223A---

CDR32BX273A---

12,000

15,000

18,000

22,000

27,000

K,M

BX

100

50

CDR32BP750B---

CDR32BP820B---

CDR32BP910B---

75

82

91

F,J,K

BP

100

CDR32BX333A---

CDR32BX393A---

33,000

39,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

81

MIL-PRF-55681/Chips

Military Part Number Identification CDR33/34/35

CDR33/34/35 to MIL-PRF-55681/9/10/11

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1/

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1210/CDR33 (BP)

AVX Style 1812/CDR34 (BX)

CDR33BP102B---

CDR33BP112B---

CDR33BP122B---

CDR33BP132B---

CDR33BP152B---

1,000

1,100

1,200

1,300

1,500

F,J,K

BP

100

CDR34BX273B---

CDR34BX333B---

CDR34BX393B---

CDR34BX473B---

CDR34BX563B---

27,000

33,000

39,000

47,000

56,000

K,M

BX

100

CDR33BP162B---

CDR33BP182B---

CDR33BP202B---

CDR33BP222B---

CDR33BP242A---

1,600

1,800

2,000

2,200

2,400

F,J,K

BP

100

50

CDR34BX104A---

CDR34BX124A---

CDR34BX154A---

CDR34BX184A---

100,000

120,000

150,000

180,000

K,M

BX

50

CDR33BP272A---

CDR33BP302A---

CDR33BP332A---

2,700

3,000

3,300

F,J,K

BP

50

AVX Style 1825/CDR35 (BP)

CDR35BP472B---

CDR35BP512B---

CDR35BP562B---

CDR35BP622B---

CDR35BP682B---

4,700

5,100

5,600

6,200

6,800

F,J,K

BP

100

AVX Style 1210/CDR33 (BX)

CDR33BX153B---

CDR33BX183B---

CDR33BX223B---

CDR33BX273B---

CDR33BX393A---

15,000

18,000

22,000

27,000

39,000

K,M

BX

100

50

CDR35BP752B---

CDR35BP822B---

CDR35BP912B---

CDR35BP103B---

CDR35BP113A---

7,500

8,200

9,100

10,000

11,000

F,J,K

BP

100

50

CDR33BX473A---

CDR33BX563A---

CDR33BX683A---

CDR33BX823A---

CDR33BX104A---

47,000

56,000

68,000

82,000

100,000

K,M

BX

50

CDR35BP123A---

CDR35BP133A---

CDR35BP153A---

CDR35BP163A---

CDR35BP183A---

12,000

13,000

15,000

16,000

18,000

F,J,K

BP

50

AVX Style 1812/CDR34 (BP)

CDR35BP203A---

CDR35BP223A---

20,000

22,000

F,J,K

BP

50

CDR34BP222B---

CDR34BP242B---

CDR34BP272B---

CDR34BP302B---

CDR34BP332B---

2,200

2,400

2,700

3,000

3,300

F,J,K

BP

100

AVX Style 1825/CDR35 (BX)

CDR35BX563B---

CDR35BX683B---

CDR35BX823B---

CDR35BX104B---

CDR35BX124B---

56,000

68,000

82,000

100,000

120,000

K,M

BX

100

CDR34BP362B---

CDR34BP392B---

CDR34BP432B---

CDR34BP472B---

CDR34BP512A---

3,600

3,900

4,300

4,700

5,100

F,J,K

BP

100

50

CDR35BX154B---

CDR35BX184A---

CDR35BX224A---

CDR35BX274A---

CDR35BX334A---

150,000

180,000

220,000

270,000

330,000

K,M

BX

100

50

CDR34BP562A---

CDR34BP622A---

CDR34BP682A---

CDR34BP752A---

CDR34BP822A---

5,600

6,200

6,800

7,500

8,200

F,J,K

BP

50

CDR35BX394A---

CDR35BX474A---

390,000

470,000

K,M

BX

50

CDR34BP912A---

CDR34BP103A---

9,100

10,000

F,J,K

BP

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1/ The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

82

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

8mm

12mm

Paper or Embossed Carrier

Embossed Only

0612, 0508, 0805, 1206,

1210

1812, 1825

2220, 2225

1808

Paper Only

0201, 0306, 0402, 0603

Qty. per Reel/7" Reel

2,000, 3,000 or 4,000, 10,000, 15,000

Contact factory for exact quantity

3,000

500, 1,000

Contact factory for exact quantity

Qty. per Reel/13" Reel

5,000, 10,000, 50,000

Contact factory for exact quantity

10,000

4,000

REEL DIMENSIONS

Tape

A

Max.

B*

Min.

D*

Min.

N

Min.

W₂

Max.

C

W₁

W₃

(1)

Size

7.90 Min.

(0.311)

8.40 ⁺^-0¹^.^.⁰⁵

14.4

8mm

(0.331 -⁺0⁰.^.0⁰⁵⁹

)

(0.567)

10.9 Max.

(0.429)

330

(12.992)

1.5

(0.059)

13.0 ⁺^-0⁰^.^.²⁵⁰⁰

20.2

(0.795)

50.0

(1.969)

(0.512⁺-0⁰.^.0⁰0²8⁰

)

11.9 Min.

(0.469)

15.4 Max.

(0.607)

12.4 ⁺^-0²^.^.⁰⁰

18.4

(0.724)

12mm

(0.488 -⁺0⁰.^.0⁰⁷⁹

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

83

Embossed Carrier Configuration

8 & 12mm Tape Only

10 PITCHES CUMULATIVE

TOLERANCE ON TAPE

0.2mm ( 0.008)

EMBOSSMENT

P₀

T₂

T

D₀

P₂

DEFORMATION

BETWEEN

EMBOSSMENTS

Chip Orientation

E₁

A₀

W

F

E₂

TOP COVER

TAPE

B₁

B₀

P₁

K₀

T₁

D

₁FOR COMPONENTS

CENTER LINES

OF CAVITY

S₁

MAX. CAVITY

SIZE - SEE NOTE 1

2.00 mm x 1.20 mm AND

LARGER (0.079 x 0.047)

B₁IS FOR TAPE READER REFERENCE ONLY

INCLUDING DRAFT CONCENTRIC AROUND B₀

User Direction of Feed

8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

S₁Min.

T Max.

T₁

8mm

and

12mm

1.50 -⁺0⁰.^.0¹⁰

1.75 0.10

4.0 0.10

2.0 0.05

0.60

(0.024)

0.60

(0.024)

0.10

(0.004)

Max.

(0.059 -⁺0⁰.^.0⁰⁰⁴

)

(0.069 0.004) (0.157 0.004) (0.079 0.002)

VARIABLE DIMENSIONS

Tape Size

B₁

Max.

D₁

Min.

E₂

Min.

F

P₁

R

T₂

W

Max.

A₀B₀K₀

Min.

See Note 5 See Note 2

4.35

1.00

6.25

3.50 0.05

4.00 0.10

25.0

2.50 Max.

(0.098)

8.30

8mm

See Note 1

(0.171)

(0.039)

(0.246) (0.138 0.002) (0.157 0.004)

(0.984)

(0.327)

8.20

(0.323)

1.50

(0.059)

10.25

5.50 0.05

4.00 0.10

30.0

(1.181)

6.50 Max.

(0.256)

12.3

(0.484)

12mm

(0.404) (0.217 0.002) (0.157 0.004)

8mm

1/2 Pitch

4.35

(0.171)

1.00

(0.039)

6.25

3.50 0.05

2.00 0.10

25.0

(0.984)

2.50 Max.

(0.098)

8.30

(0.327)

(0.246) (0.138 0.002) (0.079 0.004)

12mm

Double

Pitch

8.20

(0.323)

1.50

(0.059)

10.25

5.50 0.05

8.00 0.10

30.0

(1.181)

6.50 Max.

(0.256)

12.3

(0.484)

(0.404) (0.217 0.002) (0.315 0.004)

NOTES:

2. Tape with or without components shall pass around radius “R” without damage.

1. The cavity defined by A₀, B₀, and K₀shall be configured to provide the following:

Surround the component with sufficient clearance such that:

3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.

Refer to EIA-556.

a) the component does not protrude beyond the sealing plane of the cover tape.

b) the component can be removed from the cavity in a vertical direction without mechanical

restriction, after the cover tape has been removed.

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. If P₁= 2.0mm, the tape may not properly index in all tape feeders.

c) rotation of the component is limited to 20º maximum (see Sketches D & E).

d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).

Top View, Sketch "F"

Component Lateral Movements

0.50mm (0.020)

Maximum

0.50mm (0.020)

Maximum

84

Paper Carrier Configuration

8 & 12mm Tape Only

10 PITCHES CUMULATIVE

TOLERANCE ON TAPE

0.20mm ( 0.008)

P₀

D₀

P₂

T

E₁

BOTTOM

COVER

TAPE

TOP

COVER

TAPE

F

W

E₂

B₀

G

T₁

A₀

P₁

CAVITY SIZE

SEE NOTE 1

CENTER LINES

OF CAVITY

User Direction of Feed

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

T₁

G. Min.

R Min.

1.50 -⁺0⁰.^.0¹⁰

8mm

and

12mm

1.75 0.10

4.00 0.10

2.00 0.05

0.10

(0.004)

Max.

0.75

(0.030)

Min.

25.0 (0.984)

See Note 2

Min.

(0.059 -⁺0⁰.^.0⁰⁰⁴

)

(0.069 0.004) (0.157 0.004) (0.079 0.002)

VARIABLE DIMENSIONS

P¹

Tape Size

E₂Min.

F

W

A₀B₀

See Note 1

T

See Note 4

8mm

4.00 0.10

(0.157 0.004)

6.25

(0.246)

3.50 0.05

(0.138 0.002)

8.00 -⁺0⁰.^.1³0⁰

(0.315 ⁺-0⁰.^.0⁰0¹4²

)

1.10mm

(0.043) Max.

for Paper Base

Tape and

4.00 0.010

(0.157 0.004)

10.25

(0.404)

5.50 0.05

(0.217 0.002) (0.472 0.012)

12.0 0.30

12mm

1.60mm

(0.063) Max.

for Non-Paper

Base Compositions

8mm

1/2 Pitch

2.00 0.05

(0.079 0.002)

6.25

(0.246)

3.50 0.05

(0.138 0.002)

8.00 ⁺^-0⁰^.^.¹³⁰⁰

(0.315 ⁺-0⁰.^.0⁰0¹4²

)

12mm

Double

Pitch

8.00 0.10

(0.315 0.004)

10.25

(0.404)

5.50 0.05

12.0 0.30

(0.217 0.002) (0.472 0.012)

NOTES:

2. Tape with or without components shall pass around radius “R” without damage.

1. The cavity defined by A₀, B₀, and T shall be configured to provide sufficient clearance

surrounding the component so that:

3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket

holes. Refer to EIA-556.

a) the component does not protrude beyond either surface of the carrier tape;

b) the component can be removed from the cavity in a vertical direction without

mechanical restriction after the top cover tape has been removed;

c) rotation of the component is limited to 20º maximum (see Sketches A & B);

d) lateral movement of the component is restricted to 0.5mm maximum

(see Sketch C).

4. If P₁= 2.0mm, the tape may not properly index in all tape feeders.

Top View, Sketch "C"

Component Lateral

0.50mm (0.020)

Maximum

0.50mm (0.020)

Maximum

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556

85

Bulk Case Packaging

BENEFITS

BULK FEEDER

• Easier handling

• Smaller packaging volume

(1/20 of T/R packaging)

• Easier inventory control

• Flexibility

Case

Cassette

• Recyclable

Gate

Shooter

CASE DIMENSIONS

Shutter

Slider

12mm

36mm

Mounter

Head

Expanded Drawing

110mm

Chips

Attachment Base

CASE QUANTITIES

Part Size

0402

0603

0805

1206

Qty.

(pcs / cassette)

10,000 (T=.023")

8,000 (T=.031")

6,000 (T=.043")

5,000 (T=.023")

4,000 (T=.032")

3,000 (T=.044")

80,000

15,000

86

Basic Capacitor Formulas

I. Capacitance (farads)

XI. Equivalent Series Resistance (ohms)

.224 K A

E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)

English: C =

T_D

XII. Power Loss (watts)

.0884 K A

Power Loss = (2 π fCV²) (D.F.)

Metric: C =

T_D

XIII. KVA (Kilowatts)

II. Energy stored in capacitors (Joules, watt - sec)

KVA = 2 π fCV²x 10^-3

1

E = ⁄

2

CV²

XIV. Temperature Characteristic (ppm/°C)

III. Linear charge of a capacitor (Amperes)

Ct – C₂₅

C₂₅(T_t– 25)

T.C. =

x 10⁶

dV

dt

I = C

XV. Cap Drift (%)

C₁– C₂

C₁

IV. Total Impedance of a capacitor (ohms)

Z =ͱ R²_S+ (X - X )²

C.D. =

x 100

C

L

V. Capacitive Reactance (ohms)

XVI. Reliability of Ceramic Capacitors

1

x =

c

L₀

V_t

X

T_t

Y

2 π fC

=

( ) ( )

L_t

V_o

T_o

VI. Inductive Reactance (ohms)

x_L= 2 π fL

XVII. Capacitors in Series (current the same)

VII. Phase Angles:

Any Number:

1

---

Ideal Capacitors: Current leads voltage 90ꢁ

Ideal Inductors: Current lags voltage 90ꢁ

Ideal Resistors: Current in phase with voltage

=

+

C

C₁

C₂

C

T

N

C₁C₂

C₁+ C₂

VIII. Dissipation Factor (%)

Two: C =

T

E.S.R.

D.F.= tan ␦ (loss angle) =

= (2 πfC) (E.S.R.)

XVIII. Capacitors in Parallel (voltage the same)

X

c

C = C₁+ C₂--- + C

T

N

IX. Power Factor (%)

XIX. Aging Rate

P.F. = Sine ␦ (loss angle) = Cos (phase angle)

P.F. = (when less than 10ꢀ) = DF

f

^{A.R. = ꢀ}D ^{C/decade of time}

XX. Decibels

db = 20 log

X. Quality Factor (dimensionless)

V₁

V₂

1

Q = Cotan ␦ (loss angle) =

D.F.

METRIC PREFIXES SYMBOLS

Pico

Nano

Micro

Milli

Deci

Deca

Kilo

Mega

Giga

Tera

X 10^-12

X 10^-9

X 10^-6

X 10^-3

X 10^-1

X 10⁺¹

X 10⁺³

X 10⁺⁶

X 10⁺⁹

X 10⁺¹²

K

A

= Dielectric Constant

= Area

f

= frequency

= Inductance

= Loss angle

= Phase angle

L_t

= Test life

L

␦

V_t

V_o

T_t

= Test voltage

T_D= Dielectric thickness

= Operating voltage

= Test temperature

= Operating temperature

V

t

= Voltage

f

= time

X & Y = exponent effect of voltage and temp.

T_o

R

= Series Resistance

L_o

= Operating life

s

87

General Description

Basic Construction – A multilayer ceramic (MLC)

capacitor is a monolithic block of ceramic containing two

sets of offset, interleaved planar electrodes that extend to

two opposite surfaces of the ceramic dielectric. This simple

structure requires a considerable amount of sophistication,

both in material and manufacture, to produce it in the quality

and quantities needed in today’s electronic equipment.

Electrode

Ceramic Layer

End Terminations

Terminated

Edge

Terminated

Edge

Margin

Electrodes

Multilayer Ceramic Capacitor

Figure 1

Formulations – Multilayer ceramic capacitors are available

in both Class 1 and Class 2 formulations. Temperature

compensating formulation are Class 1 and temperature

stable and general application formulations are classified

as Class 2.

Class 2 – EIA Class 2 capacitors typically are based on the

chemistry of barium titanate and provide a wide range of

capacitance values and temperature stability. The most

commonly used Class 2 dielectrics are X7R and Y5V. The

X7R provides intermediate capacitance values which vary

only 15ꢀ over the temperature range of -55ꢁC to 125ꢁC. It

finds applications where stability over a wide temperature

range is required.

Class 1 – Class 1 capacitors or temperature compensating

capacitors are usually made from mixtures of titanates

where barium titanate is normally not a major part of the

mix. They have predictable temperature coefficients and

in general, do not have an aging characteristic. Thus they

are the most stable capacitor available. The most popular

Class 1 multilayer ceramic capacitors are C0G (NP0)

temperature compensating capacitors (negative-positive

0 ppm/ꢁC).

The Y5V provides the highest capacitance values and is

used in applications where limited temperature changes are

expected. The capacitance value for Y5V can vary from

22ꢀ to -82ꢀ over the -30ꢁC to 85ꢁC temperature range.

All Class 2 capacitors vary in capacitance value under the

influence of temperature, operating voltage (both AC and

DC), and frequency. For additional information on

performance changes with operating conditions, consult

AVX’s software, SpiCap.

88

General Description

Effects of Voltage – Variations in voltage have little effect

on Class 1 dielectric but does affect the capacitance and

dissipation factor of Class 2 dielectrics. The application of DC

voltage reduces both the capacitance and dissipation factor

while the application of an AC voltage within a reasonable

range tends to increase both capacitance and dissipation

|factor readings. If a high enough AC voltage is applied,

eventually it will reduce capacitance just as a DC voltage will.

Figure 2 shows the effects of AC voltage.

Table 1: EIA and MIL Temperature Stable and General

Application Codes

EIA CODE

Percent Capacity Change Over Temperature Range

RS198

Temperature Range

X7

X6

X5

Y5

Z5

-55°C to +125°C

-55°C to +105°C

-55°C to +85°C

-30°C to +85°C

+10°C to +85°C

Cap. Change vs. A.C. Volts

X7R

Code

Percent Capacity Change

50

40

30

20

D

E

F

P

R

S

T

3.3%

4.7%

7.5%

10%

15%

22%

10

0

+22%, -33%

+22%, - 56%

+22%, -82%

U

V

12.5

25

37.5

50

EXAMPLE – A capacitor is desired with the capacitance value at 25°C to

increase no more than 7.5% or decrease no more than 7.5% from

-30°C to +85°C. EIA Code will be Y5F.

Volts AC at 1.0 KHz

Figure 2

Capacitor specifications specify the AC voltage at which to

measure (normally 0.5 or 1 VAC) and application of the wrong

voltage can cause spurious readings. Figure 3 gives the volt-

age coefficient of dissipation factor for various AC voltages at

1 kilohertz. Applications of different frequencies will affect the

percentage changes versus voltages.

MIL CODE

Symbol

Temperature Range

A

B

C

-55°C to +85°C

-55°C to +125°C

-55°C to +150°C

D.F. vs. A.C. Measurement Volts

X7R

Cap. Change

Zero Volts

Cap. Change

Rated Volts

Symbol

10.0

Curve 1 - 100 VDC Rated Capacitor

Curve 2 - 50 VDC Rated Capacitor

Curve 3 - 25 VDC Rated Capacitor

Curve 3

Curve 2

R

S

W

X

Y

Z

+15%, -15%

+22%, -22%

+22%, -56%

+15%, -15%

+30%, -70%

+20%, -20%

+15%, -40%

+22%, -56%

+22%, -66%

+15%, -25%

+30%, -80%

+20%, -30%

8.0

6.0

4.0

Curve 1

2.0

0

Temperature characteristic is specified by combining range and change

symbols, for example BR or AW. Specification slash sheets indicate the

characteristic applicable to a given style of capacitor.

.5

1.0

1.5

2.0

2.5

AC Measurement Volts at 1.0 KHz

In specifying capacitance change with temperature for Class

2 materials, EIA expresses the capacitance change over an

operating temperature range by a 3 symbol code. The first

symbol represents the cold temperature end of the tempera-

ture range, the second represents the upper limit of the

operating temperature range and the third symbol represents

the capacitance change allowed over the operating temper-

ature range. Table 1 provides a detailed explanation of the EIA

system.

Figure 3

Typical effect of the application of DC voltage is shown in

Figure 4. The voltage coefficient is more pronounced for

higher K dielectrics. These figures are shown for room tem-

perature conditions. The combination characteristic known as

voltage temperature limits which shows the effects of rated

voltage over the operating temperature range is shown in

Figure 5 for the military BX characteristic.

89

General Description

capacitors and is why re-reading of capacitance after 12 or

24 hours is allowed in military specifications after dielectric

strength tests have been performed.

Typical Cap. Change vs. D.C. Volts

X7R

5

0

Typical Curve of Aging Rate

X7R

+1.5

0

-5

-10

-15

-20

-1.5

25%

50%

Percent Rated Volts

Figure 4

75%

100%

-3.0

-4.5

Typical Cap. Change vs. Temperature

X7R

-6.0

-7.5

+20

+10

0

1

10

100 1000 10,000 100,000

Hours

0VDC

Characteristic Max. Aging Rate %/Decade

None

2

7

C0G (NP0)

X7R, X5R

Y5V

-10

-20

-30

Figure 6

Effects of Frequency – Frequency affects capacitance and

impedance characteristics of capacitors. This effect is much

more pronounced in high dielectric constant ceramic

formulation than in low K formulations. AVX’s SpiCap

software generates impedance, ESR, series inductance,

series resonant frequency and capacitance all as functions

of frequency, temperature and DC bias for standard chip

sizes and styles. It is available free from AVX and can be

downloaded for free from AVX website: www.avx.com.

-55 -35 -15 +5 +25 +45 +65 +85 +105 +125

Temperature Degrees Centigrade

Figure 5

Effects of Time – Class 2 ceramic capacitors change

capacitance and dissipation factor with time as well as

temperature, voltage and frequency. This change with time is

known as aging. Aging is caused by a gradual re-alignment

of the crystalline structure of the ceramic and produces an

exponential loss in capacitance and decrease in dissipation

factor versus time. A typical curve of aging rate for

semistable ceramics is shown in Figure 6.

If a Class 2 ceramic capacitor that has been sitting on the

shelf for a period of time, is heated above its curie point,

1

(125ꢁC for 4 hours or 150ꢁC for ⁄

2

hour will suffice) the part will

de-age and return to its initial capacitance and dissi-pation

factor readings. Because the capacitance changes

rapidly, immediately after de-aging, the basic capacitance

measurements are normally referred to a time period

sometime after the de-aging process. Various manufacturers

use different time bases but the most popular one is one day

or twenty-four hours after “last heat.” Change in the aging

curve can be caused by the application of voltage and

other stresses. The possible changes in capacitance due to

de-aging by heating the unit explain why capacitance changes

are allowed after test, such as temperature cycling, moisture

resistance, etc., in MIL specs. The application of high voltages

such as dielectric withstanding voltages also tends to de-age

90

General Description

Effects of Mechanical Stress – High “K” dielectric ceramic

capacitors exhibit some low level piezoelectric reactions

under mechanical stress. As a general statement, the piezo-

electric output is higher, the higher the dielectric constant of

the ceramic. It is desirable to investigate this effect before

using high “K” dielectrics as coupling capacitors in extremely

low level applications.

Energy Stored – The energy which can be stored in a

capacitor is given by the formula:

E = ¹⁄ CV²

2

E = energy in joules (watts-sec)

V = applied voltage

C = capacitance in farads

Reliability – Historically ceramic capacitors have been one

of the most reliable types of capacitors in use today.

The approximate formula for the reliability of a ceramic

capacitor is:

Potential Change – A capacitor is a reactive component

which reacts against a change in potential across it. This is

shown by the equation for the linear charge of a capacitor:

L_o

L_t

V_t

X

T_t

T_o

Y

=

͑ ͑

V_o

dV

dt

I_ideal

=

C

where

L_o= operating life

L_t= test life

V_t= test voltage

T_t= test temperature and

T_o= operating temperature

in ꢁC

where

I = Current

C = Capacitance

V_o= operating voltage

X,Y = see text

dV/dt = Slope of voltage transition across capacitor

Thus an infinite current would be required to instantly change

the potential across a capacitor. The amount of current a

capacitor can “sink” is determined by the above equation.

Historically for ceramic capacitors exponent X has been

considered as 3. The exponent Y for temperature effects

typically tends to run about 8.

Equivalent Circuit – A capacitor, as a practical device,

exhibits not only capacitance but also resistance and

inductance. A simplified schematic for the equivalent circuit

is:

A capacitor is a component which is capable of storing

electrical energy. It consists of two conductive plates (elec-

trodes) separated by insulating material which is called the

dielectric. A typical formula for determining capacitance is:

C = Capacitance

L = Inductance

R_p= Parallel Resistance

R_s= Series Resistance

.224 KA

R_P

C =

t

C = capacitance (picofarads)

K = dielectric constant (Vacuum = 1)

A = area in square inches

t = separation between the plates in inches

(thickness of dielectric)

L

R _S

C

.224 = conversion constant

Reactance – Since the insulation resistance (R_p) is nor-

mally very high, the total impedance of a capacitor is:

(.0884 for metric system in cm)

Capacitance – The standard unit of capacitance is the

farad. A capacitor has a capacitance of 1 farad when 1

coulomb charges it to 1 volt. One farad is a very large unit

and most capacitors have values in the micro (10^-6), nano

(10^-9) or pico (10^-12) farad level.

Z = R²+ (X_C- X_L)²

S

ͱ

where

Z = Total Impedance

R = Series Resistance

X_C^s= Capacitive Reactance =

1

Dielectric Constant – In the formula for capacitance given

above the dielectric constant of a vacuum is arbitrarily chosen

as the number 1. Dielectric constants of other materials are

then compared to the dielectric constant of a vacuum.

2 π fC

X_L= Inductive Reactance = 2 π fL

The variation of a capacitor’s impedance with frequency

determines its effectiveness in many applications.

Dielectric Thickness – Capacitance is indirectly proportional

to the separation between electrodes. Lower voltage require-

ments mean thinner dielectrics and greater capacitance per

volume.

Phase Angle – Power Factor and Dissipation Factor are

often confused since they are both measures of the loss in

a capacitor under AC application and are often almost

identical in value. In a “perfect” capacitor the current in the

capacitor will lead the voltage by 90ꢁ.

Area – Capacitance is directly proportional to the area of the

electrodes. Since the other variables in the equation are

usually set by the performance desired, area is the easiest

parameter to modify to obtain a specific capacitance within

a material group.

91

General Description

di

dt

The

seen in current microprocessors can be as high as

I (Ideal)

0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic

inductance can cause a voltage spike of 30mV. While this

does not sound very drastic, with the Vcc for

microprocessors decreasing at the current rate, this can be

a fairly large percentage.

I (Actual)

Loss

Angle

Phase

Angle

␦

Another important, often overlooked, reason for knowing the

parasitic inductance is the calculation of the resonant

frequency. This can be important for high frequency, by-

pass capacitors, as the resonant point will give the most

signal attenuation. The resonant frequency is calculated

from the simple equation:

f

V

IR_s

In practice the current leads the voltage by some other phase

angle due to the series resistance R_S. The complement of this

angle is called the loss angle and:

f^res=

1

ͱ

2␲ LC

Insulation Resistance – Insulation Resistance is the

resistance measured across the terminals of a capacitor and

consists principally of the parallel resistance R^Pshown in the

equivalent circuit. As capacitance values and hence the area

of dielectric increases, the I.R. decreases and hence the

product (C x IR or RC) is often specified in ohm farads or

more commonly megohm-microfarads. Leakage current is

determined by dividing the rated voltage by IR (Ohm’s Law).

Power Factor (P.F.) = Cos or Sine ␦

f

Dissipation Factor (D.F.) = tan ␦

for small values of ␦ the tan and sine are essentially equal

which has led to the common interchangeability of the two

terms in the industry.

Dielectric Strength – Dielectric Strength is an expression

of the ability of a material to withstand an electrical stress.

Although dielectric strength is ordinarily expressed in volts, it

is actually dependent on the thickness of the dielectric and

thus is also more generically a function of volts/mil.

Equivalent Series Resistance – The term E.S.R. or

Equivalent Series Resistance combines all losses both

series and parallel in a capacitor at a given frequency so

that the equivalent circuit is reduced to a simple R-C series

connection.

Dielectric Absorption – A capacitor does not discharge

instantaneously upon application of a short circuit, but

drains gradually after the capacitance proper has been

discharged. It is common practice to measure the dielectric

absorption by determining the “reappearing voltage” which

appears across a capacitor at some point in time after it has

been fully discharged under short circuit conditions.

E.S.R.

C

Dissipation Factor – The DF/PF of a capacitor tells what

percent of the apparent power input will turn to heat in the

capacitor.

Corona – Corona is the ionization of air or other vapors

which causes them to conduct current. It is especially

prevalent in high voltage units but can occur with low voltages

as well where high voltage gradients occur. The energy

discharged degrades the performance of the capacitor and

can in time cause catastrophic failures.

E.S.R.

X_C

Dissipation Factor =

= (2 π fC) (E.S.R.)

The watts loss are:

Watts loss = (2 π fCV²) (D.F.)

Very low values of dissipation factor are expressed as their

reciprocal for convenience. These are called the “Q” or

Quality factor of capacitors.

Parasitic Inductance – The parasitic inductance of

capacitors is becoming more and more important in the

decoupling of today’s high speed digital systems. The

relationship between the inductance and the ripple voltage

induced on the DC voltage line can be seen from the simple

inductance equation:

di

dt

V = L

92

Surface Mounting Guide

MLC Chip Capacitors

REFLOW SOLDERING

Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

D1

D2

D3

D4

D5

0.85 (0.033)

1.70 (0.067)

2.30 (0.091)

3.00 (0.118)

4.00 (0.157)

5.60 (0.220)

6.60 (0.260)

0.30 (0.012)

0.60 (0.024)

0.80 (0.031)

1.00 (0.039)

0.25 (0.010)

0.50 (0.020)

0.70 (0.028)

1.00 (0.039)

2.00 (0.079)

3.60 (0.142)

4.60 (0.181)

0.30 (0.012)

0.60 (0.024)

0.80 (0.031)

1.00 (0.039)

0.35 (0.014)

0.50 (0.020)

0.75 (0.030)

1.25 (0.049)

1.60 (0.063)

2.50 (0.098)

2.00 (0.079)

3.00 (0.118)

6.35 (0.250)

5.00 (0.197)

6.35 (0.250)

D2

D1

D3

D4

D5

Dimensions in millimeters (inches)

Component Pad Design

Component pads should be designed to achieve good

solder filets and minimize component movement during

reflow soldering. Pad designs are given below for the most

common sizes of multilayer ceramic capacitors for both

wave and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85ꢀ of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

WAVE SOLDERING

D2

Case Size

0603

D1

D2

D3

D4

D5

D1

D3

D4

3.10 (0.12)

4.00 (0.15)

5.00 (0.19)

1.20 (0.05)

1.50 (0.06)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

1.20 (0.05)

1.50 (0.06)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

0805

1206

Dimensions in millimeters (inches)

D5

Component Spacing

Preheat & Soldering

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less

important for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

The rate of preheat should not exceed 4ꢁC/second to

prevent thermal shock. A better maximum figure is about

2ꢁC/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150ꢁC.

In all other cases this differential should not exceed 100ꢁC.

For further specific application or process advice, please

consult AVX.

Cleaning

≥1.5mm (0.06)

≥1mm (0.04)

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

≥1mm (0.04)

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

93

Surface Mounting Guide

Recommended Soldering Profiles

Recommended Reflow Profiles

Pb Free Recommended

REFLOW SOLDER PROFILES

AVX RoHS compliant products utilize termination

finishes (e.g.Sn or SnAg) that are compatible

275

250

Pb Free Max with care

Sn Pb Recommended

225

with all Pb-Free soldering systems and are fully

200

reverse compatible with SnPb soldering systems.

A recommended SnPb profile is shown for

comparison; for Pb-Free soldering, IPC/JEDECJ-

STD-020C may be referenced. The upper line in

175

150

125

100

the chart shows the maximum envelope to which

products are qualified (typically 3x reflow cycles

75

at 260ºC max). The center line gives the

50

recommended profile for optimum wettability and

soldering in Pb-Free Systems.

25

0

20

40

60

80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420

Time / secs

Preheat:

The pre-heat stabilizes the part and reduces the

temperature differential prior to reflow. The initial ramp to

125ºC may be rapid, but from that point (2-3)ºC/sec is

recommended to allow ceramic parts to heat uniformly and

plastic encapsulated parts to stabilize through the glass

transition temperature of the body (~ 180ºC).

Wetting Force at 2nd Sec. (higher is better)

0.40

0.30

0.20

SnPb - Sn60Pb40

Sn - Sn60Pb40

0.10

0.00

Sn-Sn3.5Ag0.7Cu

Sn-Sn2.5Ag1Bi0.5Cu

Sn-Sn0.7Cu

-0.10

-0.20

-0.30

-0.40

Reflow:

In the reflow phase, the maximum recommended time

ꢃ 230ºC is 40secs. Time at peak reflow is 10secs max.;

optimum reflow is achieved at 250ºC, (see wetting balance

chart opposite) but products are qualified to 260ºC max.

Please reference individual product datasheets for

maximum limits

200

210

220

230

240

250

260

270

Temperature of Solder [C]

IMPORTANT NOTE: Typical Pb-Free reflow solders have a

more dull and grainy appearance compared to traditional

SnPb. Elevating the reflow temperature will not change this,

but extending the cool down can help improve the visual

appearance of the joint.

Cool Down:

Cool down should not be forced and 6ºC/sec is

recommended. A slow cool down will result in a finer grain

structure of the reflow solder in the solder fillet.

WAVE SOLDER PROFILES

For wave solder, there is no change in the recommended

wave profile; all standard Pb-Free (SnCu/SnCuAg) systems

operate at the same 260ºC max recommended for SnPb

systems.

Recommended Soldering Profiles

275

225

175

Preheat:

This is more important for wave solder; a higher

temperature preheat will reduce the thermal shock to SMD

parts that are immersed (please consult individual product

data sheets for SMD parts that are suited to wave solder).

SMD parts should ideally be heated from the bottom-Side

prior to wave. PTH (Pin through hole) parts on the topside

should not be separately heated.

125

Wave

75

Preheat

Cool Down

Wave:

25

250ºC – 260ºC recommended for optimum solderability.

0

50

100

150

200

250

300

350

400

Cool Down:

Time / seconds

As with reflow solder, cool down should not be forced and

6ºC/sec is recommended. Any air knives at the end of the

2nd wave should be heated.

94

Surface Mounting Guide

MLC Chip Capacitors

Handling

APPLICATION NOTES

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

Storage

The components should be stored in their “as received

packaging” where possible. If the components are removed

from their original packaging then they should be stored in

an airtight container (e.g. a heat sealed plastic bag) with

desiccant (e.g. silica gel). Storage area temperature should

be kept between +5 degrees C and +30 degrees C with

humidity ꢂ 70ꢀ RH. Storage atmosphere must be free of

gas containing sulfur and chlorine. Avoid exposing the

product to saline moisture or to temperature changes that

might result in the formation of condensation. To assure

good solderability performance we recommend that the

product be used within 6 months from our shipping date,

but can be used for up to 12 months. Chip capacitors may

crack if exposed to hydrogen (H2) gas while sealed or if

coated with silicon, which generates hydrogen gas.

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4ꢁC/second

and a target figure 2ꢁC/second is recommended. Although

an 80ꢁC to 120ꢁC temperature differential is preferred, recent

developments allow a temperature differential between the

component surface and the soldering temper-ature of 150ꢁC

(Maximum) for capacitors of 1210 size and below with a

maximum thickness of 1.25mm. The user is cautioned that

the risk of thermal shock increases as chip size or

temperature differential increases.

Solderability

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 5ꢁC for 2 1 seconds.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Soldering

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caused by the difference in coefficients of expansion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

Solder

Tin/Lead/Silver Temp. °C

60/40/0 260

Solder

Immersion Time

Seconds

Termination Type

Nickel Barrier

5

30

1

Lead-Free Wave Soldering

The recommended peak temperature for lead-free wave

soldering is 250ꢁC-260ꢁC for 3-5 seconds. The other

parameters of the profile remains the same as above.

Cooling

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4ꢁC/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

The following should be noted by customers changing from

lead based systems to the new lead free pastes.

a) The visual standards used for evaluation of solder joints

will need to be modified as lead free joints are not as

bright as with tin-lead pastes and the fillet may not be as

large.

b) Lead-free solder pastes do not allow the same self

alignment as lead containing systems. Standard

mounting pads are acceptable, but machine set up may

need to be modified.

Cleaning

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

General

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

95

Surface Mounting Guide

MLC Chip Capacitors

POST SOLDER HANDLING

Once SMP components are soldered to the board, any

bending or flexure of the PCB applies stresses to the

soldered joints of the components. For leaded devices, the

stresses are absorbed by the compliancy of the metal leads

and generally don’t result in problems unless the stress is

large enough to fracture the soldered connection.

Ceramic capacitors are more susceptible to such stress

because they don’t have compliant leads and are brittle in

nature. The most frequent failure mode is low DC resistance

or short circuit. The second failure mode is significant loss of

capacitance due to severing of contact between sets of the

internal electrodes.

Type A:

Angled crack between bottom of device to top of solder joint.

Cracks caused by mechanical flexure are very easily

identified and generally take one of the following two general

forms:

Mechanical cracks are often hidden underneath the

termination and are difficult to see externally. However, if one

end termination falls off during the removal process from

PCB, this is one indication that the cause of failure was

excessive mechanical stress due to board warping.

Type B:

Fracture from top of device to bottom of device.

96

Surface Mounting Guide

MLC Chip Capacitors

COMMON CAUSES OF

REWORKING OF MLCs

MECHANICAL CRACKING

Thermal shock is common in MLCs that are manually

attached or reworked with a soldering iron. AVX strongly

recommends that any reworking of MLCs be done with hot

air reflow rather than soldering irons. It is practically

impossible to cause any thermal shock in ceramic

capacitors when using hot air reflow.

The most common source for mechanical stress is board

depanelization equipment, such as manual breakapart, v-

cutters and shear presses. Improperly aligned or dull cutters

may cause torqueing of the PCB resulting in flex stresses

being transmitted to components near the board edge.

Another common source of flexural stress is contact during

parametric testing when test points are probed. If the PCB

is allowed to flex during the test cycle, nearby ceramic

capacitors may be broken.

However direct contact by the soldering iron tip often

causes thermal cracks that may fail at a later date. If rework

by soldering iron is absolutely necessary, it is recommended

that the wattage of the iron be less than 30 watts and the

tip temperature be ꢂ300ºC. Rework should be performed by

applying the solder iron tip to the pad and not directly

contacting any part of the ceramic capacitor.

A third common source is board to board connections at

vertical connectors where cables or other PCBs are

connected to the PCB. If the board is not supported during

the plug/unplug cycle, it may flex and cause damage to

nearby components.

Special care should also be taken when handling large (ꢃ6"

on a side) PCBs since they more easily flex or warp than

smaller boards.

Solder Tip

Preferred Method - No Direct Part Contact

Poor Method - Direct Contact with Part

PCB BOARD DESIGN

To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board.

However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is

located.

No Stress Relief for MLCs

Routed Cut Line Relieves Stress on MLC

97

AMERICAS

EUROPE

ASIA-PACIFIC

ASIA-KED

(KYOCERA Electronic Devices)

AVX Myrtle Beach, SC

Tel: 843-448-9411

AVX/Kyocera (S) Pte Ltd.,

Singapore

KED Hong Kong Ltd.

Tel: +852-2305-1080/1223

AVX Limited, England

Tel: +44-1252-770000

Tel: +65-6286-7555

AVX Northwest, WA

Tel: 360-699-8746

AVX S.A.S., France

Tel: +33-1-69-18-46-00

KED Hong Kong Ltd.

Shenzen

Tel: +86-755-3398-9600

AVX/Kyocera, Asia, Ltd.,

Hong Kong

AVX Midwest, IN

Tel: 317-861-9184

AVX GmbH, Germany

Tel: +49-8131-9004-0

Tel: +852-2363-3303

KED Company Ltd.

Shanghai

Tel: +86-21-6217-1201

AVX/Kyocera Yuhan Hoesa,

South Korea

AVX Mid/Pacific, CA

Tel: 408-988-4900

AVX SRL, Italy

Tel: +39-02-614-571

Tel: +82-2785-6504

KED Hong Kong Ltd.

Beijing

Tel: +86-10-5869-4655

AVX Northeast, MA

Tel: 617-479-0345

AVX/Kyocera HK Ltd.,

Taiwan

Tel: +886-2-2698-8778

AVX Czech Republic

Tel: +420-57-57-57-521

AVX/ELCO UK

Tel: +44-1638-675000

AVX Southwest, CA

Tel: 949-859-9509

KED Taiwan Ltd.

Tel: +886-2-2950-0268

AVX/Kyocera (M) Sdn Bhd,

Malaysia

Tel: +60-4228-1190

ELCO Europe GmbH

Tel: +49-2741-299-0

AVX Canada

Tel: 905-238-3151

KED Korea Yuhan Hoesa,

South Korea

Tel: +82-2-783-3604/6126

AVX/Kyocera International

Trading Co. Ltd.,

Shanghai

AVX South America

Tel: +55-11-4688-1960

AVX S.A., Spain

Tel: +34-91-63-97-197

KED (S) Pte Ltd.

Singapore

Tel: +86-21-6215-5588

AVX Benelux

Tel: +31-187-489-337

AVX/Kyocera Asia Ltd.,

Shenzen

Tel: +65-6509-0328

Kyocera Corporation

Japan

Tel: +81-75-604-3449

Tel: +86-755-3336-0615

AVX/Kyocera International

Trading Co. Ltd.,

Beijing

Tel: +86-10-6588-3528

AVX/Kyocera India

Liaison Office

Tel: +91-80-6450-0715

Contact:

A KYOCERA GROUP COMPANY

http://www.avx.com

S-MLCC0M409-C


型号：	08054D101BAT2A
厂家：	KYOCERA AVX
描述：	Ceramic Chip Capacitors 陶瓷芯片电容
文件：	总99页 (文件大小：2759K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

08054D101BAT2A [KYOCERA AVX]

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